Electronics Forum | Fri Jun 04 18:18:28 EDT 2004 | gabriele
Hi Ricardo, You should complete the question with more details like : - kind of components pkgs (Chips, SO,TSOP,QFP,BGA,CSP,etc) and % of them versus the total (400) - tech complexity of components (0402 ? Finest Lead and ball Pitch ? SMT conne
Electronics Forum | Tue Jun 15 09:26:00 EDT 2004 | johnthor
There was a thread in the IPC TechNet a few days ago about this subject. Basic conclusion was that there is a reliablility concern if the lead free balls don't reach liquidus with the Pb profile. Haven't tried it myself. John Thorup
Electronics Forum | Thu Jun 24 13:19:42 EDT 2004 | pjc
Contact a Camalot applications engineer with your questions about dispensing paste for 0201 or 0402 chip components. Also, a different paste formulation, different from printing, is required. John Boggiatto, 508-541-4778, jboggiatto@speedlinetech.com
Electronics Forum | Mon Jun 28 14:48:56 EDT 2004 | jdumont
Yes i was looking around that site this morning and found everything i needed. Thanks to all. Basically what im trying to do is justify the expenditure of a new NO2 generator for our IC cabinets. Ours died a little while back and we have been using
Electronics Forum | Sun Jul 18 21:36:42 EDT 2004 | KEN
This is the least desirable method (mirroring). 1. X-ray inspection becomes difficult. I will repeat: x-ray inspection becomes difficult. False fails go up. True fail detection goes down. 2. Remove and replace becomes challenging. You really
Electronics Forum | Fri Jul 16 15:01:31 EDT 2004 | waveroom
I cant wait to hear the replies. We are an Ersascope dealer. Have sold over 25 systems. Have looked at all the competitors and Fortunately in our minds, Ersa still offers the best system. Not the least expensive, but the best. I found that ease of
Electronics Forum | Fri Aug 06 10:04:25 EDT 2004 | AJ
Celldude, What kind of parts do you use for SSD? More specifically does your company use 0402, 0201, BGA's, etc? Also are the results of using SSD better than the normal process of applying soder paste? Also if anyone else uses SSD, what are your ex
Electronics Forum | Wed Aug 04 00:22:17 EDT 2004 | Shean Dalton
and one more thought about your original question, if the flux does look really strange and out of place, then inspect the reflow oven. A great amount of flux condensation in the reflow oven's cooling zone can cause crystalized flux to become airbor
Electronics Forum | Wed Aug 25 22:15:44 EDT 2004 | mmk
During BGA rework we are asked to protect adjacent compoennt from secondary and/or partial reflow. That is our normal process. However, the customer is asking that the peak temp of the joint at the adjacent component should not exceed 160C. Can you p
Electronics Forum | Sun Sep 12 21:31:49 EDT 2004 | Jim
MAke a new stencile and have the aperatures reduced by 20% in X and Y. This has solved 90% of all solder balling issues I have ever dealt with. Be careful with your fine pitch and micro-BGA's. If you are not having problems with fine pitch and 1:1
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