Electronics Forum | Fri Feb 15 17:50:30 EST 2008 | stevek
Creating a sound tin nickel intermetalic takes a bit more energy than other finishes (such as copper or tin). You can achieve wetting, but not have a viable intermetalic. You should cross section some intact boards from that process and see what th
Electronics Forum | Mon Feb 18 02:08:06 EST 2008 | lococost
4 days seems a lot. You could be losing flux activation causing poor wetting on the enig. Check your suppliers data sheets for paste life. If it was contamination on the PCB, you'ld expect other components to solder badly as well. Try using a bra
Electronics Forum | Tue Mar 04 20:47:48 EST 2008 | davef
Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.14, Ball Grid Array Package (BGA), Figure 4.14-3, Note 10: A1 corner must be identified by chamfer, ink, mark, metalized markings, indentation or other feature of package body, lid or integra
Electronics Forum | Mon Mar 10 04:15:22 EDT 2008 | grantp
Hi, We have had a few vendors push automatic solder paste inspection devices on us in the past, and I have resisted until now. However we have a new product with a micro BGA on it, and I am worried about yield, so am considering it seriously for th
Electronics Forum | Mon Mar 10 09:19:15 EDT 2008 | lysik
As you know 90% of defects come from the printer. This product is well worth the investment. You will improve yeilds and reduce rework. Very important with micro BGA's. Also lead free components do not self center (during reflow) as well. There is ve
Electronics Forum | Wed Mar 12 07:43:02 EDT 2008 | grantp
Hi, Thanks for the advice, and we are doing about 4000 units a month, with multiple BGA per unit, so manual inspection is totally out of the question. It sounds like the replies from people doing volume work seem to think it's a good option. I agr
Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | julienvittu
basically your problems come from the copper balance top and bottom side we are using substrate down to 0.18mm (semiconductor industry/ Bga package / SIp business) you have to respect 5% difference maximum between Top and bottom side otherwise you
Electronics Forum | Thu May 01 14:25:31 EDT 2008 | ck_the_flip
Most white papers, like this one http://members.ipc.org/ipclogin/ipcmembers/IPC/Route/0706/0706techpaper.pdf, have written that lead contamination in a lead-free solder joint leads to all sorts of reliability problems. Consensus is that, if the cont
Electronics Forum | Thu May 01 11:26:22 EDT 2008 | cdsullivan
Thank you for the reply. We do build SnPb assemblies as well as Pb-Free. I am aware of the Silver paste. However, what impact is there with reflowing SnPb components with a max temp of say 220C when using the higher Pb-Free temps?
Electronics Forum | Tue Jun 03 13:25:46 EDT 2008 | slthomas
I'm in the same boat and have to pay a little more for the standards I insist on having. You just have to work on your sales pitch a little to convince the powers-that-be that you need it. Just tell them the difference is about $50k/year in scrap and
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