Electronics Forum | Sat Jun 19 13:57:26 EDT 2010 | dan_ems
Hi, is someone who has experience in programming SI-V200 AOI machine? I'm curious how long takes to make a new program for a board with 50 types of components (30 ssop, sop, qfn, BGA and the rest up to 50 components 0603, 0805, 1206), without having
Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009
You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat
Electronics Forum | Tue Sep 14 17:08:58 EDT 2010 | daxman
Hi, Do you have an Xray machine? we've had similar problems with micros in the past. I'd place one on double sided tape and x-ray to ensure that it is centered. If it is, i'd look into other issues such as vibration or speed of the PCB in the machin
Electronics Forum | Tue Sep 14 00:22:08 EDT 2010 | sachu_70
Hi Gani, non-wettting issues can surely be resolved. At first, would appreciate if the following info could be shared. Do you supply just one PCBA product to this client or is the complaint towards one of the many products that you deliver? Also, doe
Electronics Forum | Tue Sep 14 04:00:12 EDT 2010 | genesan
Hi Sir grahamcooper22, There should not a issue in stencil since i had open the aperature 1:1(one to one).Futhemore this is HASL pcb coating as now our customer had convert to immersion silver.I had do comparison between both and found HASL wetting n
Electronics Forum | Tue Sep 14 21:03:42 EDT 2010 | genesan
Hi Sir, The diameter of the aperature is 17mil and thickness 6mil and since we are using Solder Paste Inspection i believe that should have a good paste deposit on this pad.Let say if no good paste it will more create insufficient solder which X-RAY
Electronics Forum | Fri Sep 17 07:33:56 EDT 2010 | scottp
Based on the last few pictures in the report, the root cause is lousy HASL. In fact, you don't have HASL - you've got SnCu intermetallic. Don't mess with your reflow profile, change paste, or monkey with anything else in your process. Have the boar
Electronics Forum | Mon Oct 04 18:48:43 EDT 2010 | rsthompson
I am trying to assess current industry thinking on the question of whether or not lead-free BGAs (SAC or other) can or should be soldered in a tin/lead process. It seems there are differing opinions on this and I'm wondering what some of you are doin
Electronics Forum | Tue Oct 05 14:34:40 EDT 2010 | 18424
I am trying to assess current industry thinking > on the question of whether or not lead-free BGAs > (SAC or other) can or should be soldered in a > tin/lead process. It seems there are differing > opinions on this and I'm wondering what some of
Electronics Forum | Tue Oct 05 15:21:48 EDT 2010 | mikesewell
Nothing wrong with using RoHS BGAs except that the spheres won't melt/collapse at normal leaded reflow temps. Reliability will questionable. Some people use a hybrid profile with a slightly higher temp (~230C)and a slightly longer TAL (60 -90 sec).
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