Electronics Forum: bga (Page 431 of 546)

BGA rework systems

Electronics Forum | Mon Nov 25 12:57:29 EST 2002 | caldon

Maxtim- I have used APE's Sniper, airvac, Mecal's 3500, PDR, Pace, and MArtin's rework stations. APE Sniper does the Job but to much automation and not user friendly software. PDR is to much IR and no convection. Metcal's work good now with the ne

Smartmedia connector in reflow soldering

Electronics Forum | Sat Nov 23 10:19:39 EST 2002 | davef

This sounds alot like the warping that we all see periodically in BGA. CTE of material is temperature dependent and not temperature changing rate dependent, so you are pretty much hosed by the physics. Regardless, I do like trying like crazy to g

Solder Sphere/pad size plotted vs. pitch design?

Electronics Forum | Thu Dec 05 17:40:24 EST 2002 | davef

While unfamiliar with some of the terms you use, could this be what you seek? http://www.pcbstandards.com/downloads/Metric%20Environment/General%20Documentation/PCB%20Design/PCB%20Design%20Routing/Metric%20BGA%20Routing.pdf Stepping backwards just

Zevatech 720

Electronics Forum | Thu Dec 12 00:36:11 EST 2002 | Frank

We had one of these years ago. We had trouble with it recognizing fiducials consistently, but other than that it ran good. This assumes that the left head, which is mechanical centering, is working good. And I believe that the minimum component

8 MIL VIAS OPENING DURING THE ASSEMBLY PROCESS

Electronics Forum | Fri Dec 13 12:10:36 EST 2002 | STEPHEN WALTERS

WE ARE EXPERENCING OPEN 8 MILL VIAS UNDER THE BGA'S, THEY ARE OPENING AFTER THE ASSEMBLY PROCESS, THEY ARE FROM MULTIPLE PCB VENDORS, THEY PASS AT THE PCB SUPPLIERS TESTING, AND WE HAVE FOUND THAT THEY HAVE HAD 2 MAJOR CAUSES 1. BUBBLE INTRAPMENT, 2.

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 13:10:49 EST 2002 | gramsey

Really? Where does it say that? I have had the opposite experience and 3.2.2 from the IPC-7525 states for square or rectangular apertures - "Having a radiused corner for all apertures can promote stencil cleaning". It actually recommends circular ape

Solder short-BGA with thermal pad

Electronics Forum | Sat Dec 28 02:58:12 EST 2002 | emeto

If the problem is in the big thermal pad.The surface strains in that pad are different then the others and through the reflow period there is an affinity between them(only if they are too close). I recommend you to reduce the theramal pad. Make smal

Micro BGA coplanarity

Electronics Forum | Mon Mar 24 08:57:20 EST 2003 | russ

I don't know if I would call it a "blow hole". what I believe happens (I don't have a camera to watch spheres during the reflow process) is that when the flux starts heating up, expansion, bubbling, or something physically displaces the balls. We fo

Inline Washers

Electronics Forum | Thu Feb 27 15:33:37 EST 2003 | James

We need to use water-soluble paste due to cleanliness requirements. No-clean does not mean No-contamination. I have talked to a lot of people who use no-clean and they still wash their boards except now they have to use chemicals to do it. So, you

Tantalum caps causing misaligned parts

Electronics Forum | Fri Mar 21 10:28:27 EST 2003 | mantis

Sorry i didnt explain it vey well,the parts that are misaligned are always sitting next to these particular tanatlum capacitors.It affects 0805 parts and A tsop36 and can even cause a short on a bga right in the corner where the tant sits.If you chan


bga searches for Companies, Equipment, Machines, Suppliers & Information

Beau Tech
Beau Tech

A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.

Manufacturer

98 Elm St.
Portland, ME USA

Phone: 1-207-775-6139