Electronics Forum | Tue Jun 15 17:36:32 EDT 2004 | johnthor
I don't recall if a specific alloy was mentioned just that most lead free alloys would not melt with a Pb profile and result in a less reliable joint in the long term. There was also concern about tin whiskers. Try the archives at http://www.ipc.or
Electronics Forum | Wed Jun 23 13:03:01 EDT 2004 | russ
I would ditto CAL, we have a jewel box 90 with the 5 axis and we love it. I really like being able to tilt,rotate,and move side to side front to back, Angle viewing under a BGA can be very informative as to the quality of reflow in seeing ball coll
Electronics Forum | Thu Jun 24 12:02:59 EDT 2004 | russ
I have never done these components before, but if you have performed capability studies on your dispense equipment you should be able to tell if this is feasable. I can tell you that 0402 and 0201 especially 0201 requires great accuracy and volume.
Electronics Forum | Thu Jun 24 12:30:06 EDT 2004 | deonn
Thank you for your input Russ. I do understand the technical challenges that 0402-0201 present. As a matter of fact, I personally think it is a bad idea for these devices to even be processed using conventional assembly methods when the alternative
Electronics Forum | Thu Jun 24 16:14:04 EDT 2004 | buki
I used an old camalot 1818 with solder paste dispener system to do 0402 components on LTCC. It worked very well, but there are tricks that you have to learn. Volume and placement of the dots is critical. I am sure the latest dispense equipment have s
Electronics Forum | Sat Jun 26 15:26:10 EDT 2004 | russ
I am very happy with Alpha Metals WS709 or even WS609. Almost all of our product is Immersion gold and we place down to 16mil pitch every day along with 0201 and uBGA. Immersion gold from my experience, solders extremely well with every paste I hav
Electronics Forum | Mon Jun 28 10:02:06 EDT 2004 | fmonette
The answer is yes, it is possibly a moisture-related problem. You can confirm this by baking your parts at 125C for 48 hours (ref. J-STD-033A, table 4-1). For more technical background on this issue I recommend you read the following paper : Impac
Electronics Forum | Tue Jun 29 14:42:55 EDT 2004 | davef
You're correct, for every dumpster full of paper written about solder, there's a sentance written about fluxes. There's dribs and drabs about fluxes in most of the soldering books [ie, Manko, Klein-Wassink, Judd, Strauss, etc] and most of that is ve
Electronics Forum | Mon Jul 19 12:57:59 EDT 2004 | Frank
Awhile back there was a thread here about needing to pick a BGA-type component that is dead-bug (ball-side up). The OP was looking for a special nozzle tip that will conform around the balls in order to pick the component. There were a few response
Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN
Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka
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