Electronics Forum | Wed Aug 03 05:16:11 EDT 2005 | kokjianling
hi all, i want to find out the differences of the manufacturing processes between - PBGA - EBGA - CTBGA - Themally Enhanced PBGA(TEPBGA) - High Performance BGA - MCM-PBGA - Chip array - chip array (CASON) - Super FlipChip - flip Chip CSP (FCCSP) - St
Electronics Forum | Mon Aug 22 09:57:46 EDT 2005 | gavinscott
Hi All, The method that I use when training operators is.. a visual aid that shows the operators what way the trays are placed into the machine and the polarity of the component and also the component change logs. The matrix trays that I have delt w
Electronics Forum | Wed Aug 24 21:57:45 EDT 2005 | adeline_ko
The blistering is around the plugging via. I can forward you the pic. For the plugging process, I'm not too sure how they plug. What is the correct practise for the plugging via. Now, what they did is. They will do a tenting process for both side.
Electronics Forum | Thu Aug 25 09:56:08 EDT 2005 | james
I ran a profile on a dummy board with no parts and the peak temp is 220. The 220 is just the temperature of the board of course. With that BGA on it, I am pretty sure it sucks up alot of the heat. Also I am looking at the profile and notice that i
Electronics Forum | Wed Oct 05 15:03:40 EDT 2005 | Amol
depends on what you want evaluated! you can thermal cycle the BGAs and the examine the x-sections to determine failure modes at different stages of thermal cycles. you can do a stress test and corelate the # of thermal cycles with the microstructu
Electronics Forum | Thu Oct 20 16:42:53 EDT 2005 | PWH
Does anyone know if it is possible to run 0402/0603/0805/1206's on a Samsung CP30V vision system? I'm attempting to get some life out of this machine but greatly dislike the chucking nozzles. My hope is to run rect. packages accross vision using M1
Electronics Forum | Tue Nov 22 10:12:13 EST 2005 | stepheniii
Have you complained yet to MuRata? You are talking about the same bluetooth module, aren't you. I hope everybody having trouble with module complains to them. I don't believe they put all the cautions and warnings about reducing the deltaT on the da
Electronics Forum | Sun Nov 27 20:47:51 EST 2005 | lerry king
such as : 1, Proof of Design (POD) The DFM/CE Book for Printed Circuit Boards, Assemblies and All Manner of Other Things Technical - by Earl Moon 2, Surface-Mount Technology for PC Boards James Holloman PROMPT Publications July 1995 509 pages 3,
Electronics Forum | Tue Dec 13 12:47:53 EST 2005 | grantp
Hi, No because we don't have the ability to do that, and what is the problem with it? Can you describe what happens and how it's different to soldering a high temp BGA solder ball. My guess is if the solder ball does not melt, then there should be n
Electronics Forum | Wed Dec 14 06:58:29 EST 2005 | jdumont
We have a version of the SMT Tools scope. We use it hand held style with no stand (much easier). We also find that it is not used very often. XRay and a reliable process are more important to spend the time and money on. This is a good tool to have f
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