Electronics Forum | Sat Jun 06 15:11:17 EDT 2009 | ysutariya
Was this a lead-free capable material that fits into IPC 4101/126 or /129, like an Isola 370HR? I would not be surprised because from the picture I think I can see resin underneath the lifted copper, which is an interlaminate separate. This is a
Electronics Forum | Tue Jun 09 10:21:30 EDT 2009 | c111
We have had issues for the last 4-5 years with converting our stock from leaded to ROHS components. We are a CM and have customers who want all ROHS and some that are still leaded. The problems we run into are when we intrduce a new ROHS component wh
Electronics Forum | Sat Jun 27 10:10:23 EDT 2009 | ysutariya
I'm not in assembly, but I do know of a technology called Sipad if you are only looking to do small batches. They pre-apply the solderpaste to boards with a light adhesive, which allows you to hand-place components, even micro BGA's and fine-pitch Q
Electronics Forum | Thu Aug 13 12:23:39 EDT 2009 | robhs
Thanks Dave. What you say makes complete sense. We ran a job a short while back in this way (though without bonding) and found we had a much higher than normal failure of the BGAs which I can only attribute to the secondary reflow. As I have only got
Electronics Forum | Mon Aug 24 10:35:54 EDT 2009 | rossi
I don't think its an issue with the PCB. When we just put the paste down and not the BGA the solder paste seems to adhere to the PCB pads very well (not brittle). Also we have other very similar PCBs that we run different normal silver content BGAs
Electronics Forum | Wed Aug 26 05:13:01 EDT 2009 | grahamcooper22
Hi, as you are using Vapour phase reflow what temperature is the boiling point of the solvent you are using ? If it is @ 250 C then you should be getting everything hot enough to melt the ball and solder paste together. If this is the case then your
Electronics Forum | Tue Sep 08 15:25:35 EDT 2009 | davef
larob57 Question are: * If we are in the XBox repair business, what makes you think that that we would provide you with information about our business practices? * Don't you realize that we are solely Wii users and have never taken the cover off of a
Electronics Forum | Fri Nov 20 09:07:43 EST 2009 | Sean
Hi all, Another thing that I would like to discuss here is that I used to come across few reports that mention about the flux residue has great impact on the PCBA impedance, especially when everything become smaller and smaller...I mean, when mother
Electronics Forum | Tue Nov 24 19:07:12 EST 2009 | gregoryyork
I agree Patrick many people blame the assembly fluxes when it is some other hygroscopic chemistry left on the bare PCB such as surfactents from the HASL process these will do exactly what the guy reported in his post fail then cool down and pass ever
Electronics Forum | Mon Dec 21 10:20:47 EST 2009 | zanolli
We are looking to purchase a table top batch oven, with nitrogen, for prototype work on various PCB assy's - some with BGA's. The intent is to simulate a multi-zone production oven profile - and we kow that an exact simulation is not possible - just
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