Electronics Forum | Mon Mar 08 05:11:36 EST 1999 | Earl Moon
| | | And on it goes. Again, I can't thank you enough for your time. I will call you soon as others probably find this rhetoric a bit much. | | | | Earl Moon | | | Earl and Dean, | | No,no,no...please continue here. I've been gratefully rea
Electronics Forum | Wed Aug 12 07:22:52 EDT 1998 | Earl Moon
| | | | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated,
Electronics Forum | Tue Feb 04 22:28:16 EST 2003 | davef
You could reduce the paste by about 70%. Solder balling and tombstoning will be the issues to fight. The drivers to these don't change with the component size. Use the fine SMTnet Archives for background. Aperture Size and Thickness of Solder Pas
Electronics Forum | Sun Jul 28 16:11:40 EDT 2013 | jfs
Greetings! I run a small CM company in the > Midwest. We built our business on THT production > for the boutique music products industry and are > currently planning our launch of a > low-volume/high-mix SMT line to support the > growth of our
Electronics Forum | Tue Jul 20 05:29:14 EDT 1999 | Wolfgang Busko
| | | | | | | | Hi, SMTASSY | | | | | | that�s what we do, soldering our double-sided-finepitch-BGA-and all-the-other-stuff-boards in vapourphase because it�s the only thing we have. | | | First, we do not do real series produktion, only prototypi
Electronics Forum | Mon Jun 21 14:51:37 EDT 1999 | JohnW
| | Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of assem
Electronics Forum | Mon Jun 21 16:36:54 EDT 1999 | John Thorup
| | | Does anyone have experience with placing heat sinks on BGAs? I have limited experience with PSA (pressure sensitive adhesives)heat sinks, and am interested with the possibility of a clip-on device. I am specifically concerned with ease of ass
Electronics Forum | Thu Jun 03 10:09:59 EDT 1999 | Earl Moon
| In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We cann
Electronics Forum | Thu Jun 03 10:53:09 EDT 1999 | Ryan Jennens
| | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We ca
Electronics Forum | Thu Jun 03 12:31:30 EDT 1999 | Dave F
| | | In a month or so, we will be getting an in-line x-ray inspection machine. It will require that we solder our most comlicated side (normally top) first. This is opposite to our process now where we solder our passive (bottom) side first. We
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