Electronics Forum | Thu Jun 23 03:43:45 EDT 2005 | ajaydoshi
Hi Jerry, > > Thanks for the info. Is vision > number required for the IP3? From the manual it > appears not (needed for IP1 & 2), however vision > type is required. > > Thanks, Dave We are using IP3 & placing BGA. BGA part data only for outer
Electronics Forum | Wed Aug 10 14:11:38 EDT 2005 | rrylande
Does anyone have suggestions or observations on what my maximum board temperature should be when doing BGA repairs on an SRT? In other words, How hot is too hot? Somebody set the bottom heater on our new BGA repair machine to blow at 275 C, and our
Electronics Forum | Thu Oct 20 06:03:23 EDT 2005 | Slaine
during the soldering process on larger BGAs the corners can bend up or down due the large copper heatsink on top expanding quicker than the material the bga is made out of, in the worst cases this can lead to to the balls lifting out of the paste and
Electronics Forum | Thu Nov 03 12:52:23 EST 2005 | Amol
the only problem i see here is the neighboring components (depending upon the component density) will surely undergo a second reflow during the rework stage for the BGA. this way the only lead you will have in the BGA assembly is if you are using HA
Electronics Forum | Sat Jan 14 08:13:14 EST 2006 | gipos Mike
We are doing a lot of CSP-BGA rework with tacky flux from Senju Metal.Their flux is very good.We are buying directly from Japan 529D flux. We have reworked BGA processor plastic sockets of Fujitsu Laptops. What kind of flux you are using? Not all of
Electronics Forum | Tue Jan 24 03:42:54 EST 2006 | aj
what problems are you having, does your machine software support BGA . Are you downloading the Part Data sheet with all the dimensions , pitch etc. If you want to tell me a BGA package that you are having problems with I will send you Part Data.
Electronics Forum | Tue Mar 28 15:11:56 EST 2006 | GS
Hi MLC, did you profiled the BGA itself? I mean detect Temperatures on middle/central ball vs external ball and see how much is the delta Temperature. Best practice is to keep the delta T at minimum as possible especially on a so large BGA. Sure
Electronics Forum | Tue Jun 13 23:08:32 EDT 2006 | mrduckmann2000
WINSLOW IS NOT THE BEST CHOICE, WE HAVE TRIED SEVERAL DIFFERNET STYLES OF BGA'S WITH NO LUCK. WINSLOW HAS EVEN HAD TROUBLE RE-BALLING OUR BGA'S. THEY SUGGEST LONG BAKE TIMES, DIFFERENT FLUXES...ETC NOTHING HAS WORKED PERFECTLY. THE PREFORMS ARE B
Electronics Forum | Wed Jul 12 11:35:07 EDT 2006 | samir
Let's pretend there's no complication with RoHS, backward, foreward compatability - bla, bla, bla Vikings. I would pick the BGA hands-down! 1.) The BGA Ball, the component's lead, IS the solder joint! 2.) No complanarity issues, bent leads, etc
Electronics Forum | Fri Aug 25 08:13:51 EDT 2006 | saaitk
Hi Folks, When temp profiling bga rework how important is thermocouple placement. Have read that holes should be drilled from board underside into ball to accomodate probe (isn't theory wonderful). Probably ok for high volume rework but for 1 or 2 of
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