Electronics Forum: bga 0.6 (Page 1 of 2)

Stencil for BGA re-balling

Electronics Forum | Fri Nov 07 01:01:55 EST 2008 | mskler

What should be stencil size to reball the BGA of 0.6MM ball dia.

QP 242

Electronics Forum | Thu Mar 10 06:16:37 EST 2011 | ravo

I am asking if I can assemble BGA components with my machine QP242. My BGA spec : WIDTH * LENGTH = 27*27 MM PIN DIAMETE = 0.6 MM Thankd in advance.

BGA ball vs land design problem??

Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0

Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem

BGA pad size too large??

Electronics Forum | Wed Sep 07 00:28:04 EDT 2011 | woodsmt

I have identified a Board design issue and having trouble convincing others of my findings. I have a BGA (Sn63 balls, +1500 IO, 0.6mm ball, 1mm pitch, with heat spreader plate)that has a high incidence of solder shorting on the corners. The board i

BGA assembly and inspection

Electronics Forum | Thu Sep 07 03:57:39 EDT 2000 | Steven Cheung

Does anyone know of a freely-available document which discusses the main considerations of BGA assembly and inspection (x-ray?). l need to know about pad sizes and inspection standards and when to underfill and when not to etc.. l am looking at ass

Re: MicroBGA printing problem

Electronics Forum | Mon Sep 20 17:46:21 EDT 1999 | Dave F

I've had some trouble pasting a test board for a MicroBGA trial. Most of the paste remains in the stencil apertures. The stencil is 6 mil thick, laser cut and electo-polished. The apertures are 12 mil in diameter with 20 mil pitch. We are usi

672 PBGA on PC Card .015 thick pcb

Electronics Forum | Thu Oct 11 22:25:50 EDT 2001 | davef

Bruce I�m with yall. Designers and fabricators say �pins�. You say: * BGA pins are 1mm [0.039�] pitch. * BGA pads are 0.4mm [0.0157�] diameter. * BGA pins are 0.6 mm [0.024�] side-to-side. * Board thickness is ~0.4 mm [0.015�] First, as you can

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh

I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean

BGA footprint on PCB

Electronics Forum | Mon Jun 25 20:37:14 EDT 2001 | davef

You are 100% correctamundo that the pad on PCB should be the same as the pad on the BGA interposer, but let�s not expend that thinking to the aperture of your solder paste stencil, right away. Generally, paste on large pitch BGA is often 1:1, but as

BGA - Unmasked Vias

Electronics Forum | Thu Jul 12 10:15:12 EDT 2007 | swag

I've got a proto build (3 boards) that has a Xilinx FG456 fine-pitch BGA on it. Every BGA pad on the PCB has an unmasked via attached. Between the via and the pad is a thin soldermask strip, maybe .005" wide at best. I am very confident it will br

  1 2 Next

bga 0.6 searches for Companies, Equipment, Machines, Suppliers & Information

Sell Used SMT & Test Equipment

Best Reflow Oven
Benchtop Fluid Dispenser

World's Best Reflow Oven Customizable for Unique Applications
SMT spare parts - Qinyi Electronics

MSD Dry Cabinets
pcb precision cleaning

Easily dispense fine pitch components with ±25µm positioning accuracy.


Thermal Transfer Materials.