Electronics Forum: bga and balls and move and ceramic (Page 1 of 1)

I want to learn about bga technology from a pick and place mache

Electronics Forum | Wed Jul 14 16:03:25 EDT 2010 | malcolmlanders

I seemed to have learned that on the bga chip that the soider is the soider balls on the chip. If this is true how do you get the chip to not move on the board when being inspected bdfore you soider it. and even in the transport of the board to the o

BGA Device with Slanted and Damaged Spheres

Electronics Forum | Wed Dec 15 19:31:26 EST 2004 | Thomas Denison

We have a ceramic BGA that the component supplier has misaligned the spheres in the fixture so they slant .007" out of alignment from the substrate pads. When the devices are tested at the component manufacturer this alignment issue also causes the

Re: Relationship between BGA and PCB substrate

Electronics Forum | Thu Dec 10 09:09:31 EST 1998 | Earl Moon

| Hi everybody? | I heard that typical FR-4 would not acceptable for BGA application. | What is the main reason? | (thermal property? or CTE?) | Sombody please answer me the requirement of PCB substrate for PCB application. | Thanks. | | Youngho Son

BGA dead bug pick and place

Electronics Forum | Wed Oct 30 09:43:01 EST 2002 | gregp

Larger tighter spaced balls will present a problem in sealing the vacuum cup. There will be more leakage in this case. It really depends upon the application. The BGA you mention should not be a major concern. The bigger problems are with bigger

Pb free BGA and Sn Pb solder paste

Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken

profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Tue May 17 08:00:26 EDT 2005 | Bob R.

We went through this with one PBGA supplier recently and they were able to get the problem under control by fixing some of their molding processes that were inducing residual stresses. You can really see it in a thermal moire where you measure warpa


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