Electronics Forum: bga and high and temperature (Page 1 of 8)

6 layer board and routing bga package

Electronics Forum | Tue Feb 16 13:58:02 EST 2016 | tsvetan

this document http://www.latticesemi.com/view_document?document_id=671 may be good start point but note that how to escape from the BGA is not big deal, how to route your filtering capcitors, grounding, impedance control lof you high speed signals ar

Re: Voids and BGA

Electronics Forum | Sun Mar 01 15:52:13 EST 1998 | Earl Moon

From several months I am investigation about the VOIDS PERSENCE and his important as reliability. One question now is : It is possible that on the BGA components the voids are already present into the balls, before the mounting on the pcb ? I

Water wash flux and cleaning

Electronics Forum | Mon Jun 19 09:47:23 EDT 2017 | georgetruitt

You have a lot to think about! What does the flux manufacturer recommend as far as specifics like water temp or pressure? Do they recommend high temp di-water a detergent or saponifier? Do you currently have a cleaning machine, batch cleaner or inl

BGA rework and reliability

Electronics Forum | Thu Oct 22 11:11:58 EDT 1998 | Hon

Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rework on

Headers and SMT

Electronics Forum | Fri Oct 30 10:17:05 EDT 2015 | esoderberg

You don't say how many headers you have to solder. I usually spec in High temp headers and use a pin-in-paste methodology and double reflow. Can you get your headers high temperature?

Dye and Pry

Electronics Forum | Thu Mar 13 01:42:58 EDT 2008 | Sean

Thanks Real Chunks and Davef...Yours input is valuable to me. My inputs towards your question asked below: Questions are: * Why did you tell us the following? "This BGA is installed with heatsink (with hook at both side of the heat sink) manually b

Mydata Pick and place

Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul

My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 19:32:02 EST 2000 | Michael Parker

Prof. Whoopee - amazing facts that you find on your 3-D BB, it has completely confounded my comrade, Chumley. Plainly spoken that around the SF Bay Area a.k.a. Silicon Valley(ever hear of the famous SF Fog?)during the winter months, near the coast a

Leaded and Lead-Free Wave Parameters

Electronics Forum | Thu May 22 14:44:10 EDT 2008 | samir

Does your top-side preheat NEED to be that high, and so high that you are exceeding the flux manufacturers' spec? If so, what is the reason? Top-side wetting? Are you measuring this temperature at the substrate or solder joint?

Re: BGA rework and reliability

Electronics Forum | Fri Oct 30 15:09:44 EST 1998 | ChungPark

Dear all, What are your views on reworking BGA's? I mean, with the BGA going through reflow temperatures four times or more, and with a manual reballing process, wouldn't it raise up a few reliability issues? Would you consider not doing rew

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