Electronics Forum | Tue Jul 09 10:15:17 EDT 2002 | msjohnston
Cal, Our parent company is a FAB and they are about to release a new generation of parts. Usually the die is qualified in a simple TSOP form factor. This time the first product quals will take place in the BGA and CSP from factors rather than the t
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Fri Jan 22 15:48:14 EST 1999 | Chrys
Hello, I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Wed Jul 20 08:40:27 EDT 2011 | mosborne1
Umar - This is usually seen when the lead frame in the die attach is cut with a diamond saw instead of a lasar. We have seen this problem years ago from HP 7 segment displays. If you have Enviromental box (tenney box) you can temp cycle them from 0 d
Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon
A question for you all! Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea
Electronics Forum | Tue Oct 12 17:40:01 EDT 1999 | Brian W.
A question for you all! Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. My question concerns cleaning under, through, and around tight spaces. Way back when, we coul
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