Electronics Forum | Tue Jul 09 10:15:17 EDT 2002 | msjohnston
Cal, Our parent company is a FAB and they are about to release a new generation of parts. Usually the die is qualified in a simple TSOP form factor. This time the first product quals will take place in the BGA and CSP from factors rather than the t
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
Electronics Forum | Mon Oct 06 11:13:32 EDT 2003 | marmotzj
Dear All, I'm encountering a problem on mounting Intel E7501 and P64H2 FC-BGA chips. After the SMT process, these two BGAs were defected. Both had power-to-ground short circuits on the die package itself, and also the die resin had cracking tracks
Electronics Forum | Fri Jan 22 15:48:14 EST 1999 | Chrys
| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Wed Jul 20 08:40:27 EDT 2011 | mosborne1
Umar - This is usually seen when the lead frame in the die attach is cut with a diamond saw instead of a lasar. We have seen this problem years ago from HP 7 segment displays. If you have Enviromental box (tenney box) you can temp cycle them from 0 d
Electronics Forum | Wed Jan 06 04:51:16 EST 1999 | Earl Moon
| | A question for you all! | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we could not clea
Electronics Forum | Tue Oct 12 17:40:01 EDT 1999 | Brian W.
| | | A question for you all! | | | | | | Back in the good old days, we didn't always know how clean was clean. Much has changed. Much hasn't. | | | | | | My question concerns cleaning under, through, and around tight spaces. Way back when, we coul
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