Electronics Forum: bga and solder and detect (Page 1 of 13)

I want to learn about bga technology from a pick and place mache

Electronics Forum | Wed Jul 14 16:59:52 EDT 2010 | swag

Solder paste on the pads will keep part aligned. If you do not use paste, you will need to apply tacky flux. You should not run without one or the other.

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 13:58:54 EST 2007 | ck_the_flip

I made my own wave measuring device using KIC2000 system. KIC2000 has automatic wave detection, so now I have a profiler for both reflow ovens and wave solder. The delmat carrier only cost $500. A guy, Samir, from this forum gave me the idea, actu

solder sphere and weight issues

Electronics Forum | Tue Feb 17 18:17:28 EST 1998 | John Wilson

I am looking for any information or testing data done on the amount of weight that can be held by a bga package based on size of the solder sphere and number of spheres. I am reflowing components with a bga package on the opposite side and looking f

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

Re: solder balls and flux

Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow

Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect

0201 and uBGA

Electronics Forum | Wed Jun 05 17:13:58 EDT 2002 | Yannick

Hello! I have a strage problem, we made some production with uBGA, BGA, 0201, 0805, and other type of component. We didn't put the uBGA and 0201 and BGA on the board at the end of the line we look a our solder joint and surprise the solder made a

Pb free BGA and Sn Pb solder paste

Electronics Forum | Thu May 06 08:59:25 EDT 2004 | davef

Even with PbSn solderpaste the leadfree BGA's have a superior resistance to solder-joint fatigue failure when compared to conventional parts. [Solder Fatigue Reliability Issues in Lead Free BGA Packages, Pedro Chalco of IBM, Pan Pacific Microelectron

Pb free BGA and Sn Pb solder paste

Electronics Forum | Tue Jun 01 19:23:15 EDT 2004 | Ken

profile it for the tin/lead paste. The tin in the solder paste will begin to disolve the sac ball. This is exactly the same scenario as 90/10 (80/20)high temp balls found on ceramic bga and many super bga devices (except the sac balls are now tin r

Dye and Pry

Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq

All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean

Pb free BGA and Sn Pb solder paste

Electronics Forum | Thu May 06 06:47:12 EDT 2004 | praveen

Hi, I just need to undestand any issue? If I mount Pb free BGA and use normal SN/Pb solder paste?

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