Electronics Forum | Wed Dec 26 14:21:47 EST 2007 | gersla
I am looking for suggestion of BGA 0.5mm pitch Ball 0.3mm (BGA 8x8mm)assembly and soldering. Stencil thickness? Stencil reduce? Etc.
Electronics Forum | Thu Dec 27 11:05:40 EST 2007 | realchunks
5 or 6 mil thicjk stencil and no reduction.
Electronics Forum | Fri Dec 28 17:02:04 EST 2007 | davef
We agree with Chunks
Electronics Forum | Wed Jan 02 15:32:27 EST 2008 | shrek
HA-HA-HA... Krikies. What are ya mate? A slavakian?
Electronics Forum | Wed Jan 09 19:04:48 EST 2008 | pnguyvu
5 mil thick is the max and no reduction Any question feel free give me a call @ 714-636-6211 or email me Steve@usastencils.com Regards Steve
Electronics Forum | Thu Apr 05 08:44:45 EDT 2007 | ck_the_flip
"Guest" is right, actually. CSP's are essentially BGA's, but typically the pitch and ball diameters are much smaller and in some cases, the pads of the CSP's can not be screen printed. If that's the case, you'd have to have flux-dip capabilities on
Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon
Maybe something like this could work?
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
Electronics Forum | Thu Nov 14 22:24:43 EST 2019 | dman97
Use a type 5 solder for maximum paste release.
Electronics Forum | Thu Nov 14 18:25:07 EST 2019 | myke03o
Hi Jandon, Thanks, I will try it on my DOE.
