Electronics Forum: bga ball pitch (Page 1 of 199)

Footprint for 48 ball .75mm pitch BGA

Electronics Forum | Wed Oct 20 11:32:23 EDT 2004 | pbatten

Has anyone seen a footprint for these new parts? If so where? Thanks http://america.renesas.com/media/products/common_info/package/mitsubishi/j48fhh.pdf

Footprint for 48 ball .75mm pitch BGA

Electronics Forum | Wed Oct 20 11:32:28 EDT 2004 | pbatten

Has anyone seen a footprint for these new parts? If so where? Thanks pbatten http://america.renesas.com/media/products/common_info/package/mitsubishi/j48fhh.pdf

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

Solder ball specifications?

Electronics Forum | Thu Jan 24 19:57:40 EST 2002 | davef

Are there formalized standards for the properties of solder balls? No Get IPC-7095 �Design & Assembly Process Implementation for BGA's�. General comments about array package solder balls are: * Ceramic packages use harder solder, like 90/10. * Pla

Stencil and paste used for .4mm pitch csp component ball size .3mm?

Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro

It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI

What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.

BGA ball vs land design problem??

Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0

Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem

0.5 mm pitch BGA

Electronics Forum | Wed Mar 02 10:24:48 EST 2005 | Guest

Balls are 0.30 mm diameter, with a height of 0.24 mm It's a 8*8 mm 184 pins BGA.

solder ball

Electronics Forum | Tue Dec 31 02:04:19 EST 2019 | sssamw

From the picture, I cannot see clearly solder ball violate electrical clearance or cause a short, maybe it is. What I can see is the solder paste has some misalignment although it doesn't printed in solder mask area, but actual position will reduce

mirco bga stencil opening

Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck

Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks

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