Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske
Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located
Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef
There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear
Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose
Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.
Electronics Forum | Tue Mar 09 22:20:16 EST 2004 | Ken
Is this a PBGA? If yes. run a flat steel rule or edge across the top of the PBGA. Is it flat or cupped? Is this a TBGA (super bga). I have seen issues with a suppliers heat spreader design that actually will deflect the corners down and raise the
Electronics Forum | Sun Jun 29 02:50:37 EDT 2014 | alexeis
Hi, The issue is very complex and difficult to arbitrarily divide the types of components. From research we perform today together with our customers to design a work-at-SMT accurate as much as possible, I can summarize that vast time differences de
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