Electronics Forum | Thu Feb 08 15:05:32 EST 2007 | realchunks
Wow, what a bunch of crabby old men. BGA opens can occur from pre,during or post process. I never chimmed in cause the original poster said they would performa a dye test. Yet as usual, they never get back to this forum on what the cause was. So
Electronics Forum | Tue Nov 10 07:35:04 EST 2009 | scottp
Step 1 is to find out what kind of opens you're getting through a cross-section or die & pry. Are they head in pillow, brittle fracture at the intermetallic, bulk solder cracks, ball separation from interposer? Without some basic failure analysis a
Electronics Forum | Wed May 02 06:56:52 EDT 2007 | Rob
Has anyone experienced deformed balls on BGAs - especially very low volume build to order devices? I'm looking into a possible hidden pillow defect and think I have eliminated most of the other factors I believe could cause it. Cheers, Rob.
Electronics Forum | Mon Nov 09 16:05:29 EST 2009 | sawyer
Hi, i have a big problem with a BGA, and i have no idea where could be the broblem because eveything seems to be ok(printing, placement, reflow). I have arroud 2-3% Opens from the quantity of boards produced during a shift. Can enybody help me with s
Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose
Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.
Electronics Forum | Wed May 02 11:00:46 EDT 2007 | bartlozie
to get a 0-defect layout, OEM and CM have to work together, If you know what connections (balls) are the problem ones, let me know, and send me the gerber-layers + solderpaste layer, so we can see if the problem is design related or if you CM realy