Electronics Forum: bga reflow profile (Page 1 of 374)

bga warp

Electronics Forum | Wed Sep 11 23:20:44 EDT 2002 | scottefiske

Profiles are absolutely the first course of action to validate. A few additional questions would be: * Moisture can cause warping as well, verify the manufacturers recommended handling procedures were followed. * Where is the suspect BGA located

BGA reflow profile

Electronics Forum | Mon Dec 27 11:15:17 EST 1999 | g cronin

please send me a copy of sample reflow profiles for BGA packages. Please indicate the type of BGA and the Oven used. As well as any special characteristics of the assembly that have effected the profile. I a trying to learn more about the common "t

BGA reflow profile

Electronics Forum | Mon Jul 27 13:59:11 EDT 1998 | Robert Steltman

We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutectic balls Refl

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 17:37:00 EDT 1998 | Robert Steltman

Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface und

Re: BGA reflow profile

Electronics Forum | Tue Dec 28 12:55:16 EST 1999 | Justin Medernach

Greg, The best advice that I can give you is a PBGA will respond just like any other surface mount package. There may be a 5 degree delta between a PBGA 356 and a QFP208 but the two respond very similarly in the convection reflow environment. CBGAs

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 02:13:57 EDT 1998 | Bob Willis

There is a procedure for profiling on my web site that may be of use to start with www.bobwillis.co.uk We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ======

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 02:22:59 EDT 1998 | Bob Willis

Here is what I would do faced with your problem. First I would profile a similar board or use an existing profile. From there I would place the dummy device on the surface of a sample board with a thin thermocouple soldered to the board surface under

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 09:15:49 EDT 1998 | Justin Medernach

We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic BGA with eutec

Re: BGA reflow profile

Electronics Forum | Tue Jul 28 17:23:58 EDT 1998 | Robert Steltman

We are about to run our first BGA devices and would appreciate some confirmation on a few points. First some details: PCB & Device: ============= 1) 16 layer (4 power, 4 gnd, 8 signal) 2) gold on nickel finish 3) ceramic

Hybrid reflow profile

Electronics Forum | Mon Oct 03 10:20:43 EDT 2005 | davef

Follow your component supplier recommendations. For instance: Xilinx says their lead-free alloy for their BGA spheres is SnAgCu, and liquidous is 217*C and they want you to peak at 230 - 235*C for good wetting according to their reflow guidelines.

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