Electronics Forum: bga repair heat cycles (Page 1 of 12)

Multiple reflow cycles

Electronics Forum | Wed Mar 19 21:01:49 EST 2003 | Rob

I would suggest creating a special reflow profile, heating the board up to 130C about 50 c below eutectic point (183C). Then applying heat to only the BGA, this will prevent thermal shock to surrounding components.

BGA Rework (Top side heat only!)

Electronics Forum | Thu Feb 26 12:24:02 EST 2015 | emeto

The best test will be to X-ray BGA under 3-D X-ray. About the techniques used for BGA repair you can probably take closer look to some BGA repair stations, even though I have seen it done with hot air gun in the early days.

repair the BGA/CSP device

Electronics Forum | Mon Aug 13 18:16:31 EDT 2001 | fmonette

Be very careful how you perform the removal process if you want to re-use BGA/CSP devices. As you are aware, the majority of these components are classified as moisture-sensitive by the manufacturer. This means that if they absorb too much moisture

repair the BGA/CSP device

Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon

You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki

Lead-Free SMD repair

Electronics Forum | Sat Apr 30 10:37:25 EDT 2005 | Daniel

I think he did mentioned the board size in the inital thread: "265mm x 207mm pcb", but maybe it was not clear written. I have a question about rework and pre-heat: is it necessary to have the pre-heater to cover the whole board size, even if you onl

Lead-Free SMD repair

Electronics Forum | Mon Apr 25 12:19:21 EDT 2005 | siverts

Hi all, We produced a RoHS (lead-free) prototype order recently, and there was some components that we needed to replace on a couple of PCBA's. We found it very hard to do this even with the new solder iron. The components was just small RoHS SOIC's

Recommended max board temp for BGA repair

Electronics Forum | Wed Aug 10 17:02:32 EDT 2005 | Inds

wats the thickness of your board.. and the dimension.. I would not heat the board beyond 150deg C.. coz if the board is thick and large.. it will take a long time to reach that temp..and you will burn off your flux.causing poor solder joint. Ind

Recommended max board temp for BGA repair

Electronics Forum | Wed Aug 10 14:56:03 EDT 2005 | pjc

"Too Hot" is any more heat than what is needed to reflow the solder. You should have the Auto-Profile software for the machine, this will accurately monitor and record temps. There is also port for the component itself to monitor package temp. There

About the optimum temperature of IC repair

Electronics Forum | Tue Sep 11 12:45:01 EDT 2007 | rgduval

Both questions will depend upon the IC specifications. Check the manufacturers recommendations for temperature specification, as well as reflow profiling. As a general rule, we don't like to rework a component more than 2 times after initial reflow

Re: Solder Paste Dispensing for BGA repair

Electronics Forum | Fri Nov 26 06:18:18 EST 1999 | stefano bolleri

Jeff & Ted, we have used a dispensing system too and yes, I agree, we are not too happy with the results. Not at the point that it doesn't work, though. I think our problem basicly is that we have selected an entry-level dipensing system. We are app

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