Electronics Forum: bga shape creation (Page 1 of 14)

Fuji Flexa shape creation

Electronics Forum | Wed Jun 19 16:39:22 EDT 2019 | travishemen

I think in the shape data on the shape process tab you click launch visual data editor.

Fuji Flexa shape creation

Electronics Forum | Fri Oct 04 05:45:55 EDT 2019 | rajeshoshnic

Hi,You need Fuji VPD license for using image from camera stand. Thanks

Fuji Flexa shape creation

Electronics Forum | Wed Jun 19 15:43:38 EDT 2019 | jeremy1

Hello, can some help me, i have an NXT offline camera station to take pictures from parts.How can i import these pictures into flexa to edit the leads based on the picture?

QFN shape on Fuji Flexa for CP6

Electronics Forum | Thu May 27 18:40:02 EDT 2010 | dcell_1t

Hi. I'm trying to develop a shape to place a QFN at a CP6, I'm using FujiFlexa. We have never had a shape for this particular component, we only draw as a rectangle and put a rectangle vision No (10 in this case) but we're scarifying accuracy. is th

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Wed Aug 27 08:25:24 EDT 2008 | davef

We'd expect to see: * Solder starved connections at pads with large trace/pad areas. * Less reliable solder connections at pads that do not match the shape and size of the corresponding pads on the component.

Collapsing of micro bga ball due to improper land pad design ?

Electronics Forum | Fri Aug 22 00:20:29 EDT 2008 | rameshr

Hai, In our process we are using the micro bga of size 13X13mm of pitch 0.45mm,after soldering process the bga found collapsed, we absorbed that the PCB land pattern of the BGA was not in array, uneven distribution of pads (area) & most of the pads

BGA Assembly

Electronics Forum | Tue Jun 04 12:33:57 EDT 2002 | dason_c

We use the diamond shape on the CBGA/CCGA only, all the PBGA are using the regular round shape.

QFN - FCT failed after reflow

Electronics Forum | Wed Feb 07 09:37:48 EST 2007 | billyd

Had the very same thing happen the first time we used the small QFNs. The aperture for the thermal pad in the center needs to be cut in a grid form, either squares (with around a 10 mil spacing between openings) or circles, like a BGA pattern. Too mu

Have any paper or data talking about "BGA Stencil design guideline for avoid bridge"?

Electronics Forum | Thu Sep 06 05:25:38 EDT 2018 | spoiltforchoice

I'm no expert but I think you will find the majority of discussions around BGA & good printing results focus on the PCB design and things like tented vias and pad definition. e.g https://macrofab.com/blog/bga-pad-creation-smd-nsmd/ After that, work

BGA X-Ray inspection question

Electronics Forum | Wed Mar 14 16:30:02 EST 2001 | CAL

Reading x-rays is an art. All balls should be symmetrical in size and shape. Please provide more information on your question. Why just opens? If the Balls are not consistently the same in size or shape there is a problem. Larger balls could be from

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