Electronics Forum: bga surface finish (Page 1 of 106)

Palladium silver surface finish

Electronics Forum | Thu Aug 12 20:32:44 EDT 2004 | usdigital

Indy, We use Palladium silver surface finish parts for silver epoxy attached parts only. It is our understanding that this finish is not for solder, but only silver epoxy attach. I expect that is you problem. Dave

HASL surface finish

Electronics Forum | Fri Jun 12 21:36:04 EDT 2020 | SMTA-Josh

Has anyone had an issue with changing from a HASL surface finish to a LF HASL finish if it is still being used in a leaded process? Also we are having issues with the planarity on the fiducials with the HASL finish. Are there any suggestions or ch

Palladium silver surface finish

Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy

Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t

trace surface finish

Electronics Forum | Fri Sep 06 17:21:24 EDT 2013 | rodcr

Why do PCB traces need a surface finish? On microstrip (top/bottom) the solder mask does not help

trace surface finish

Electronics Forum | Mon Sep 09 21:54:01 EDT 2013 | mandysmile

Hi, rod, The exposed copper area you could do with ENIG. It is with good solderability.

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy

Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy

Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th

Palladium Silver surface finish

Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy

Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th

HASL surface finish

Electronics Forum | Mon Jun 15 16:51:05 EDT 2020 | emeto

Tin/Lead has 183C melting point and probably around 220 peak temperature at reflow. Tin has 232C melting point. I would assume that based on this information you would understand why intermetallic joint is questionable. Go to any flat finish. HASL wi

Palladium silver surface finish

Electronics Forum | Thu Aug 12 18:06:09 EDT 2004 | SR

May I ask what component types you are using and who the suppliers are? FYI - If the components have exceeded their shelf life, they may have oxidized too much for soldering using low activity fluxes. Thanks and best regards, SR

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