Electronics Forum: bga top and bottom (Page 1 of 25)

bga warp

Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic

Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than

Double sided SMT, bottom side first or top side first ?

Electronics Forum | Fri Mar 07 03:37:26 EST 2003 | emeto

Hi Ygwie, My experience shows there is not unique answer.Actually it depends on design,printing reflow or wave.It might be top side with lesser cmps.Top side might have fine pitch or BGA or CSP,LLGA ....,so you have better planarity when the PCB is b

Process ideas for adhesive on bottom side SMD's and wave solder

Electronics Forum | Tue Nov 22 17:08:03 EST 2011 | mikenagle

I am looking for process suggestions. We want to use a pin transfer system to deposit adhesive to hold bottom side SMD's in place. We will place SMD's and through hole power parts on the top side and then run through a wave solder machine. Are ther

BGA on both Top and Bottom

Electronics Forum | Fri Jul 08 18:48:50 EDT 2005 | mdang

Hi, We are a Contract Manufacturing and have a project which has a few Xilinx BGA on top and bottom side. Does anyone run a cross this or have any suggestion on how to reflow them. Thank you, -Michael

BGA on both Top and Bottom

Electronics Forum | Wed Jul 13 16:51:28 EDT 2005 | KT

we do it all the time. We havent had any problems with the BGA's. But, you dont want BGA right beneath another BGA.

BGA on both Top and Bottom

Electronics Forum | Sat Jul 09 07:53:16 EDT 2005 | davef

Search the fine SMTnet Archives for previous discussions. Here's an example of a recent thread similar to yours http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=35114

BGA on both Top and Bottom

Electronics Forum | Thu Jul 14 15:20:15 EDT 2005 | Erik

Putting on the BGAs are relatively easy, it's the X-ray inspection of BGAs on both sides that can get tricky.


Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef

Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P

via tenting and pluging

Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam

HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef

We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats

  1 2 3 4 5 6 7 8 9 10 Next

bga top and bottom searches for Companies, Equipment, Machines, Suppliers & Information