Electronics Forum | Thu Sep 05 03:23:14 EDT 2002 | manic
Hi, I encountered a problem with pbga. One edge either warp downwards or upwards creating bridging or open. This pbga have fr4 at the bottom (compound molding at the top). The fr4 is bigger than the top compound by 3mm at each edge. Pls help. Than
Electronics Forum | Fri Mar 07 03:37:26 EST 2003 | emeto
Hi Ygwie, My experience shows there is not unique answer.Actually it depends on design,printing reflow or wave.It might be top side with lesser cmps.Top side might have fine pitch or BGA or CSP,LLGA ....,so you have better planarity when the PCB is b
Electronics Forum | Tue Nov 22 17:08:03 EST 2011 | mikenagle
I am looking for process suggestions. We want to use a pin transfer system to deposit adhesive to hold bottom side SMD's in place. We will place SMD's and through hole power parts on the top side and then run through a wave solder machine. Are ther
Electronics Forum | Fri Jul 08 18:48:50 EDT 2005 | mdang
Hi, We are a Contract Manufacturing and have a project which has a few Xilinx BGA on top and bottom side. Does anyone run a cross this or have any suggestion on how to reflow them. Thank you, -Michael
Electronics Forum | Wed Jul 13 16:51:28 EDT 2005 | KT
we do it all the time. We havent had any problems with the BGA's. But, you dont want BGA right beneath another BGA.
Electronics Forum | Sat Jul 09 07:53:16 EDT 2005 | davef
Search the fine SMTnet Archives for previous discussions. Here's an example of a recent thread similar to yours http://www.smtnet.com/forums/Index.cfm?CFApp=1&Message_ID=35114
Electronics Forum | Thu Jul 14 15:20:15 EDT 2005 | Erik
Putting on the BGAs are relatively easy, it's the X-ray inspection of BGAs on both sides that can get tricky.
Electronics Forum | Sat Jul 29 09:10:16 EDT 2006 | davef
Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board placed in an array on the bottom of the package. They are attached to the board with tiny balls of solder placed on each contact. Pin Grid Array (P
Electronics Forum | Fri Nov 03 02:32:56 EST 2006 | shivam
HI ALL, can anybody clear me what is via tenting and via pluging?? second one, if i use via in pad for an.5mm bga what care i should taken, what should be the soldermask open in top and innerlayers for via?how it will directly connect to top layer
Electronics Forum | Mon May 16 22:59:40 EDT 2005 | davef
We believe your problem is caused by the mismatch in CTE of the material ised in your BGA. In fact, this "potato chipping" [where the corners curl-up] is present in all BGA. The issue is the matter of degree. [Mismatching CTE is how old thermostats
