Electronics Forum: bga warpage (Page 1 of 8)

BGA warpage

Electronics Forum | Wed Jan 20 13:07:16 EST 1999 | Robert Noory

I have received prototype PBGA (256 pins) devices from Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I have

BGA warpage

Electronics Forum | Wed Jan 13 19:13:59 EST 1999 | Michael Allen

Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype" line at our component supplier's lab (non-production overmold material was used). Production parts have not exhibite

Re: BGA warpage

Electronics Forum | Wed Jan 20 20:42:08 EST 1999 | Tony A

| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h

Re: BGA warpage

Electronics Forum | Thu Jan 14 08:32:22 EST 1999 | Jim Nunns

They are supposed to be production parts. Our volumes are in the hundreds due to rapid change though. Jim Nunns | Just a comment: we've seen PBGAs curl up at the corners, but only on prototype components that came off of a low-volume "prototype"

Re: BGA warpage

Electronics Forum | Thu Jan 21 15:24:18 EST 1999 | Terry Burnette

| I have received prototype PBGA (256 pins) devices from | Motorola (actual part number = KXPC850ZT50). These parts seemed very warped on the edges. When I put the part on a plain surface, it rocks quite a bit when I press lightly on a corner. I h

Need a BGA warpage spec.

Electronics Forum | Wed Jan 13 17:08:20 EST 1999 | Jim Nunns

I have some BGAs with a warped chip carrier. Some of the balls are tall like columns and some are short oval shapes. How can I determine when warpage will cuase failures from stress. Is there a spec out there from studies anyone has done? Any commen

BGA CORNER WARP

Electronics Forum | Fri May 04 18:27:34 EDT 2001 | chpark

BGA warpage combined with PCB warpage can lead significant process yield loss. First, it is possible that major portion of BGA's apparent warpage is, in fact, coming from the PCB warpage. Assuming that the warpage is solely from BGA itself, I think

NexLev Open Solder and Hyper BGA

Electronics Forum | Sun Aug 01 11:39:41 EDT 2004 | Andrew

I am seeing high rate of open joint at NexLev connector and also BGA warpage issue with 52 mm Hyper BGA.anyone has the same experience?

BGA rework

Electronics Forum | Sun Mar 07 19:58:03 EST 2004 | praveen

Hello , Can any body help in solving the problem of PCB warpage during BGA rework. I am using IR heating system. No problem found in reworking BGA's size less than 30mmx30mm but for 35 mmx35mm and above BGA get solder short due to PCB warpage. Note

BGA Bowing on the corners.

Electronics Forum | Tue Aug 26 08:59:27 EDT 2003 | fmonette

For more information on moisture-induced BGA warpage, I suggest you read the following paper that was recently presented at ECTC : "Impact of Ingressed Moisture and High Temperature Warpage Behavior on the Robust Assembly Capability for Large Body

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