Electronics Forum: bismuth reflow (Page 1 of 3)

Reducing Warp after reflow

Electronics Forum | Mon Oct 31 19:37:16 EDT 2022 | emeto

Just because you can't add copper to the board, doesn't mean you can't add copper to the panel. Redesign panel, where board house can add copper to the panel to balance the board a little better. I would advise against low melting solder alloys on cu

Solder reflow temperatures too high

Electronics Forum | Thu Jan 11 22:01:09 EST 2007 | davef

Joe: I know this is not the correct forum to post chip "reworking" questions. Reply: Rework questions are as appropriate as the next topic here on SMTnet J: BGA will not reflow at any normal temperature level. I believe these chips may have been gen

Solder reflow temperatures too high

Electronics Forum | Sun Jan 14 12:42:35 EST 2007 | SMTRework

I think the main cause of this condition is #3 because both #1 and #2 never change from board to board, these are identical boards with identical BGA revisions. These BGA's (as stated before) are about 3 years old.. I don't believe they are lead free

lead free for multiple reflow process

Electronics Forum | Thu Sep 13 22:06:02 EDT 2007 | davef

While you're waiting for others to respond, here's one take on bismuth in lead-free soldering [ http://smt.pennnet.com/Articles/Article_Display.cfm?Section=Articles⊂section=Display&ARTICLE_ID=229915 ] by a long term friend of SMTnet. Find more by sea

Bismuth containing Solder Paste

Electronics Forum | Tue Jan 06 18:06:05 EST 2009 | aj

Hi all, I am currently trialling a solder paste which contains Bismuth. It is leadfree and reflows at 138 degrees C. I would appreciate any pros/cons? aj...

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Tue Jun 18 04:01:07 EDT 2019 | aite

Hi! You can choose low-temperature solder paste. The low-temperature solder paste is tin and antimony with a melting point of 138 °C. When the components of the patch cannot withstand the temperature of 200 ° C and above and the patch reflow process

Re: Double sided smt

Electronics Forum | Sat Nov 06 14:58:45 EST 1999 | Gary Moravchik

Assuming you are using Sn63/Pb37 solder paste, have you tried using a lower temp melting point solder paste for the second pass? For example, use 63/37 for first pass and a Bi58 compound solder paste for the second pass. If I recall, Bi58's melting

Solder Paste for Thermal Cycling application (-40 to 150 Degree Celcius)

Electronics Forum | Thu Sep 05 11:05:35 EDT 2019 | SMTA-Tony

There are competitors to REL solder alloys from AIM. Tin-Copper-Nickel-Bismuth alloys (Nihon Superior) are an alternative option which do very well in thermal cycle testing. The reflow profiles required are similar to SAC305 profiles. You may als

When? How and What??

Electronics Forum | Tue Aug 22 10:06:53 EDT 2000 | George English

Has there been a definite date for the total move over to lead free? Will it be 2004 or 2008. Also is there a direct replacement for leaded solder, I have read various articles on numerous alloys suggested for the switch, such as bismuth, tin, copper

Re: Bismuth

Electronics Forum | Thu Aug 24 16:59:11 EDT 2000 | Dr. Ning-Cheng Lee

For reflowed solder joints, Bi bearing solder has been reported to exhibit superior fatigue resistance. It also provides better wetting than many other alternatives, including SnAgCu systems. In my opinion, it may be the choice once all Pb can be pha

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