Electronics Forum | Wed Jun 13 16:51:26 EDT 2012 | davef
Sorry, but I don't have a quick and easy answer. Before jumping the 'black pad shark,' tell us more about your boards ... * Is the gold still on the pads after soldering? * Can you make the pads take solder using a soldering iron? * Does this happen
Electronics Forum | Wed Sep 20 14:19:26 EDT 2000 | Jason Wraight
I am sure that this is a problem that will never be solved, but something that I am seeing in increased numbers. Often refered to as "Black Pads". After production, returns from the field coming back with contaminated pads under various components.
Electronics Forum | Thu May 05 08:14:45 EDT 2011 | kahrpr
Where black pad exists, it is not a common problem. When I read it is totally random I doubt that. You have defiantly something going on that is unique with the process. It is either your board manufacturer or your solder paste or your profile. It c
Electronics Forum | Thu Nov 07 15:33:02 EST 2013 | mleber
Below are a few photos of an ongoing issue we are having with 1 pwb style. Some of the pads appear to have contamination that appears after the selective solder step. The joints are extremely hard to rework - almost impossible. We had the joints anal
Electronics Forum | Mon Jul 28 06:23:29 EDT 2008 | cobar
Please look up http://www.shanelo.co.za/Black%20Pad%20Index.htm and check out the article named"Soldering to gold a practical guide."
Electronics Forum | Wed Oct 11 16:25:04 EDT 2006 | realchunks
Board fab, Defects, Pad coatings, Gold black plague articles 1 Nick Biunno's article: http://www.nukcg.org/downloadfiles/Hadco%20on%20Immersion%20Gold%20failures.pdf 2 George Milad's article: http://www.circuitree.com/ct/cda/articleinformation/featu
Electronics Forum | Thu Feb 10 09:43:42 EST 2000 | Glenn Robertson
Russ - I agree with Dave and Wolfgang that the boards are the top suspect. The idea of "rework" from Gold to HASL sounds scary. Are you sure the Gold is electroplate and not immersion? Resolve that and then check the archives for "dark pad" or
Electronics Forum | Thu Aug 01 08:58:47 EDT 2002 | Rick Lathrop
Good morning Dave F. I am not going to try to touchup the solder pad until I get surface analysis work done, don't want to ruin the evidence. I am getting XPS work done not XRF, XPS is X-ray Photoelectron Spectroscopy and can see very thin films of o
Electronics Forum | Wed Jul 23 08:37:02 EDT 2003 | davef
Your fabricator should be able to re-apply the imm tin very easily. Actually, if we had boards like you describe [and we were sure we didn't mess them up], we'd be be making strong implications that our fab would need to make this right. Don't pin
Electronics Forum | Mon Feb 06 10:02:14 EST 2006 | Yash Sutariya
Sorry. I actually should clarify those slides. Black pad is not associated with tented vias. Also, you can tent vias with soldermask, but this requires the immersion gold process to be completed prior to soldermask. As such, all copper features (
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