Electronics Forum | Fri Aug 03 22:36:28 EDT 2001 | mugen
We used Thermal Pads, made of black rubbery material, and sticky on both sides (like x2 side tape), intent is to place in between, BGA/QFP and the PCB board, and reduce the air-gap flow between, the PCB to SMD... air-gap will permit air flow, that i
Electronics Forum | Thu Jul 27 21:57:16 EDT 2000 | Dave F
Hi Doug: Responding to your questions: � If gold over nickel is self limiting ... You didn�t say whether you gold plating was electroless or immersion. Electroless is not is self limiting. It can plate up to 5 thou. Expect immersion plated gold to
Electronics Forum | Wed Jun 29 06:57:20 EDT 2005 | mattkehoe
Hi Bob, We tried flowing the pads with a soldering iron. The pad at the tip of the iron went shiny but as soon as the iron was taken away, the pad returned to the dull finish. You could actually move the tip around the pad and it would shine up then
Electronics Forum | Thu Aug 05 21:47:35 EDT 2004 | KEN
Agreed. Joint failure can happen when un-bagging or durig box-build (at customer site). Careful handling should be used. In one case I had boards returned to me for evaluation and failure analysis. Too bad our site never built the boards!!! (jacka
Electronics Forum | Tue May 08 15:05:08 EDT 2001 | davef
It�s reasonable to want to understand this strange looking fabrication, before moving on to other issues. Before moving on to that, tell us more about your thinking the silicon being from the BGA package. What kind of plastic package is this? Desc
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Fri Mar 14 11:04:54 EDT 2008 | herman
Samir, To correct some misconceptions on the answers to your question, and "what you know from experience": With both ENIG (Electroless Nickel/Immersion Gold-IAu) and IAg (immersion silver), soldering does not take place to the gold or the silver. Wh
Electronics Forum | Tue Dec 14 17:02:04 EST 1999 | John Thorup
Hello Kris If you do have and OSP coating I'd say Curtis has nailed it. But you seem to have references to gold. Does this board have a standard nickle/gold finish. If so what sort of "solder on gold" problems were you having? Reading between the
Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef
WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall
Electronics Forum | Fri Nov 08 08:52:54 EST 2002 | dphilbrick
Juan There are many things that cause this and the first thing I would do is request quality records from your board fab facility on that particular lot. If they are unwilling to give them to you this is a good sign they had a processing problem. Th
