Electronics Forum: blistering and trace (Page 1 of 7)

Flexi boards and uBGA

Electronics Forum | Tue Jul 11 10:13:22 EDT 2006 | SWAG

Over time, you might see problems with delam., blistering and warpage if using FR4 carriers. Depending on volumes, you might consider using durostone or some robust material like that for the production runs. Keep in mind that switching materials w

warp and twist

Electronics Forum | Tue Feb 14 09:10:43 EST 2017 | davef

Assuming the traces run parallel and perpendicular to each other, I'd choose one direction the traces run as "x" and the other direction for "y." Then I'd pick a unique identifier on the board to insure proper orientation. Next, I'd measure warp and

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

Re: HAST and HALT

Electronics Forum | Sat Oct 24 06:07:09 EDT 1998 | Earl Moon

Hi, Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. thanks, subhash Most independent PCB test labs, often doing military

Re: HAST and HALT

Electronics Forum | Mon Oct 26 14:56:07 EST 1998 | carl m

Hi, Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. thanks, subhash Most independent PCB test labs, often do

Dye and Pry

Electronics Forum | Wed Mar 12 10:26:10 EDT 2008 | realchunks

Why would a board failure related problem be a process problem. I agree most companies believe EVERY problem is a Proces Problem, but in the real world we know this is not true. A pad lifting means your solder joint was able to rip it off the boa

Imm Silver and Voiding

Electronics Forum | Wed Jun 28 22:34:31 EDT 2006 | davef

Yes, it would. That you are asking this question makes us wonder if you would be better advised to contract with a independent FA laboratory to help you baseline your analysis. Among the fine labs to consider are: * Robisan Laboratory 6502 East 21

assembly serialization and traceability

Electronics Forum | Wed May 22 16:36:13 EDT 2002 | slthomas

What methods do you guys use for maintaining lot and/or board traceability? When I worked in med. products, we used travelers that we recorded everything on, then serialized them at the end of the build. Not as effective as up front serialization,

MPM Up2000 and SMEMA

Electronics Forum | Mon Sep 12 09:26:00 EDT 2016 | awhite

Our MPM Up2000 HIE is having a communication problem with any upstream machine we place in front of it...i.e. conveyor, board loader, etc. It all started when we removed a conveyor from inbetween it and a board loader, and hooked those machines up di

Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe

Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed

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