Electronics Forum: board density (Page 1 of 16)

When handling the wiring density in attention to what issues?

Electronics Forum | Fri Jul 29 15:53:26 EDT 2016 | davef

Much a the accumulated knowledge is here: IPC-2252 - Design Guide for RF/ Microwave Circuit Boards [http://www.ipc.org/TOC/IPC-2252.PDF]

Profiling board

Electronics Forum | Mon May 27 11:57:37 EDT 2002 | arcandspark

One thing you should do is characterize your reflow oven, run profile boards of various densities, say 2 gm/sq.in. to 10 gm/sq.in. Adjust the oven settings for these various boards to acheive your standard profile based on your solder paste manufactu

Re: here's one for you board stuffers!!!

Electronics Forum | Tue Jan 12 10:18:36 EST 1999 | Russ Steiner

| Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your overall quality. But I'm trying for a general answer. On pre-tested assemblies, should you exp

How to place pin supports the same everytime a board is ran?

Electronics Forum | Wed May 23 18:45:57 EDT 2012 | stentech

I would agree with Sr Tech..Grid lock and systems like this can be used on the Ekra, MPM and DEK printers also can be used in Pick and place depending on the density of pin. If you choose the method of printing out a 1:1 photoplot. Glue it to a piece

Board Spacing

Electronics Forum | Wed Apr 20 12:22:51 EDT 2005 | jdengler

Russ is correct, but you may have variations between board density types also. Some ovens may be able to handle low density boards with no spacing, but need a zone's worth of spacing for high density boards. Other ovens don't need any spacing for a

simple doubt about reflow profile

Electronics Forum | Mon Feb 12 17:24:51 EST 2007 | dave

250-260ish seems a little on the high side ? Depending on the board density and components 230-245 should suffice. Again time above is usually preferred between 30-90secs but again it really depends on the PCB Dave

Convection Oven Reflow Modeling Simulations

Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno

Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.

Convection Oven Reflow Modeling Simulations

Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno

Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.

oven profile

Electronics Forum | Fri Mar 28 04:57:41 EST 2003 | emeto

more heat.But that's not correct!If convection there are air flaws and bare board has lower temperature than a board with high density.When you have elements on board you hava a vortex and the air flaw invreases the temperature.

Heller vs. Vitronics

Electronics Forum | Tue Nov 21 13:25:25 EST 2006 | jax

Depending on Zone Temperatures, Belt Speed, and Board Density... Some Convection Ovens will drop Zone Temperatures faster than others. They recover by increasing Air Circulation. This can make parts fall off the Bottom-Side that otherwise would

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