Electronics Forum | Fri Oct 15 11:05:50 EDT 1999 | Mark Phinney
Earliar we had problems with board warpage, Much of our problem was due to imbalances in the copper on oppisite layers in brief on a 8 layer board the copper on layer 1 should = the copper on layer 8, 2=7, 3=6, 4 = 5. We added copper to some layers t
Electronics Forum | Mon Sep 17 06:11:41 EDT 2012 | kq702
Hi I did a reflow on a laptop board and after the reflow the board is warped in the area I did the reflow in, and now the laptop screen does not turn on at all when I put it back into the laptop. Original problem was the wifi (I did the reflow more o
Electronics Forum | Wed Jan 24 10:20:39 EST 2007 | electronhose
Seriously, OSP?, change the board finish, you are the OEM, correct? You have the power! Also, as another poster mentioned, high force applied at ICT ( possibily to cut through the OSP goop ?!? ) could be warping the board enough to crack the joints.
Electronics Forum | Sun May 23 10:14:14 EDT 1999 | M Cox
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Mon Jun 17 09:52:33 EDT 2013 | sara_pcb
My circuit board contains 11 x 11 matrix 1mm pitch BGA, The device was tested in socket on evaluation Board. We handed over the actual PCB & devices for re-flow. The assembly house first re-flowed all the SMT components other than BGA. BGA was placed
Electronics Forum | Tue Apr 18 10:08:51 EDT 2006 | russ
We use materials such as G10, durapol, or FR4. We put a lot of holes in the fixtures so that only enough material is left to support the board during reflow to prevent sag/ warp or whatever. We also try and keep all bot side material in unpopulated
Electronics Forum | Thu Nov 19 10:12:38 EST 1998 | Brian Conner
| For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder a
Electronics Forum | Mon Feb 20 13:29:44 EST 2006 | patrickbruneel
Great work Amol, Please keep us posted about the results of the x sectioning. I personally don't believe that the cracks are due to non-eutectic properties of SAC. Because the alloy is only 4�C off eutectic and when a solder joint exits the solder
Electronics Forum | Wed Jul 21 12:41:39 EDT 1999 | jason
I have pcb's in which i am experiencing warping. the boards are 12.8125" on a diagonal measurement. they are out approximatley .010". the boards are combination thru-hole,smt, they also have 3ounce copper.what is acceptable,and what is the propper fo
Electronics Forum | Sat Aug 21 15:02:32 EDT 2010 | jry74
I have a pcb with 750 plated through holes that get Holtite sockets inserted into them. I have a method of pressing in 10 sockets at a time. However, when we are done, the board has bad warpage on the X and Y axis. Does anyone out there have any t
