Electronics Forum: board.after (Page 16 of 21)

Re: PCB washing

Electronics Forum | Tue Feb 01 21:48:12 EST 2000 | Dave F

Guo: You want to know: 1 Can I use water as the solvent in an ultrasonic machine to remove solder paste from PCB? Continuing from Jason�s comments: Sure you can use water as the solvent to remove solder paste from PCB, but recognize that some flu

Re: smt on flexible board

Electronics Forum | Mon Dec 20 19:09:54 EST 1999 | Chris

If your flex circuit is only populated on one side, you can have the PCB vendor palletize the flex for you. What you do is have the flex circuit laminated to 062" FR4 using a thermoset adhesive like Dupont WA. Standard flex circuit adhesive. Howev

Re: How are your solder balls @ wave solder ?

Electronics Forum | Mon Oct 11 12:24:07 EDT 1999 | John Thorup

| | Folk's, | | | | I'm just tying up some loose end's on my Master's Thesis on solderballing @ wave soldering and the effect the topography of the mask / PCB has on it. | | I was wanting to do a straw poll on you guy's as to the type of resist's yo

Re: problem when testing the RF product

Electronics Forum | Wed Jun 23 16:54:16 EDT 1999 | Frank Frimpong

| Do anyone have any experience on assembling high frequency product, 1.8GHz or 2.4GHz. | | In our production line, we manufacture 1.8GHz product with using no clean paste (RMA type) for reflow and no clean wire for rework. In our functinal test,eit

Re: Heatsinks for surface mount devices - adhesive alternative!

Electronics Forum | Mon May 24 17:17:21 EDT 1999 | JohnW

| | Can anyone steer me towards a supplier of heatsinks suitable for use on a PQFP 160. Before you shoot me down in flames, I know that I am not going to get much heat away from the die because of the plastic but the application is such that the boar

Shootenem from a-far

Electronics Forum | Sun May 16 10:11:50 EDT 1999 | M Cox

| I'm running memory module product- SMT double reflow ( 12 modules per panel). I'm using the epoxy base solder paste in order to reduce the flux spattering problem onto the gold finger which could lead to the intermittent contact problem. | | I do

Re: 2% silver solder paste

Electronics Forum | Fri Apr 16 11:07:53 EDT 1999 | Vic Lau

| | We process both tin/lead plated boards and gold plated boards in our surface mount group. I have used Sn62/Pb36/Ag2 solder paste on all gold plated boards to help prevent gold scavaging. To reduce the amount of different solder pastes we have t

Re: the SOD-80 er the MELFs

Electronics Forum | Mon Jan 25 21:25:46 EST 1999 | Dave F

| | I am searching for application notes on the SOD-80. Also, I am looking for any problems that have been discovered while using it. Also, we are looking for the pick and place equipment upgrades that will be needed to use the package- Pricing, ma

Re: the SOD-80 er the MELFs

Electronics Forum | Fri Jan 29 22:31:37 EST 1999 | Darren

| | | I am searching for application notes on the SOD-80. Also, I am looking for any problems that have been discovered while using it. Also, we are looking for the pick and place equipment upgrades that will be needed to use the package- Pricing,

Re: Cleaning No-Clean

Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt

Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go


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