Electronics Forum | Fri Dec 20 06:12:17 EST 2013 | bandjwet
Jimmy: Make sure to look in and around the board to make sure you have captured all locations of solder balls/fines as they are commonly caused by the profile or print issues. If they are non-embedded and are a 610 defect based on the class of your
Electronics Forum | Fri Jan 03 15:16:54 EST 2014 | ppminc
If all of the lights are on, on the operator interface panel usually that means the EPCU is defective or not fully seated correctly. If you swapped out the EPCU board from another machine you need to make sure its the same type of machine. If it has
Electronics Forum | Tue Feb 04 09:52:49 EST 2014 | emeto
Whenever your line doesn't cover your requirements and you can't build your boards in schedule, it is time to go to higher throughput machines. Of course you should have some contracts for the next year or two that will cover your line. You should kn
Electronics Forum | Wed Feb 12 22:02:47 EST 2014 | rober864
Has anyone ever encountered contaminants from the immersion silver process, whether it be from the board house or not...as it relates to conformal coating. The failure mode is severe de-wetting of acrylic conformal coating. All over solver resist, to
Electronics Forum | Tue Feb 18 11:02:05 EST 2014 | cunningham
Thanks for the reply. Yes we currently have an Ionagraph setup at the bottom of the wash where we take the first board out for that day and check it for contamination. Im just wanting to get an idea if any jets are blocked and that the temperature
Electronics Forum | Thu Mar 27 07:56:04 EDT 2014 | rrosera
My company is researching the use of re-workable underfill for use on our avionics boards. We are currently testing Hysol UF3810. The Rework machine we use has a vacuum based removal system witch isn't strong enough to overcome the underfill. We have
Electronics Forum | Mon Mar 31 20:21:54 EDT 2014 | sonavc
Thank you for all help. Finally I got this old machine ran. Now sometimes, I get this error " R FENCE " . I checked the center photoelectric beam at the rear of the machine was good. Sometime I 'm so lucky turn it on and it work. now the problem o
Electronics Forum | Mon Apr 07 11:53:44 EDT 2014 | hegemon
It's right there in front of you. Not enough overall temperature across the board. No wetting issue is evident, just looks like you need to turn up the heat, as Dave has mentioned. SOB has mentioned the issues surrounding the Electrolytic caps, ch
Electronics Forum | Thu Apr 17 07:51:19 EDT 2014 | emeto
Opens are on the device to the PCB - mainly on the edges, that makes me think I get some kind of warping,but even if I bake parts and boards doesn't help. We also tried different reflow profiles - same results. I hear that some people use dip fluxers
Electronics Forum | Wed May 07 08:16:58 EDT 2014 | emeto
It really depends on pad design and other component on the PCB. Most of the time I run 0201s I have microBGAs on the board and usually print 3mil. Reduction will depend on the paste. For leaded paste you will have reduction (about 10% or so).For Lea
