Electronics Forum | Sat Feb 14 12:25:37 EST 2004 | I ramos
I populate several thin panels (0.032")using a > Samsung S-2000 P-N-P machine. With panel sizes > of 8" by 10", it is very difficult to clamp the > panels into the machine with deflection and > bowing. Also, the Samsung makes it very difficult
Electronics Forum | Fri Apr 02 01:10:01 EST 2004 | Grant Petty
Hi, We tried that, as the Soltec has a spray fluxer that can flux just the connector part of the board, however we get really heavy solder deposits on the rest of the board that has no flux sprayed on it, so we seem to need to coat the entire board.
Electronics Forum | Wed Apr 21 08:53:04 EDT 2004 | TONY
I am having problems with one certain board that is gold immersion. I know it is not oven problems or part problems because it is various parts that are moving during reflow. Also I have not had problems with any other boards going through the same
Electronics Forum | Mon Apr 26 08:15:37 EDT 2004 | pjc
MPM uses a one-print-Mylar system, as do other printer mfrs. In this system there is a Mylar sheet attached to a frame that is secured over the printer table with the board on it. You print onto the Mylar. The table X-Y-theta manual adjustments are u
Electronics Forum | Wed Apr 28 09:43:22 EDT 2004 | Rob
When it comes to double-sided boards, how does one support a board so that those supports don't hit any components on the side already run but yet keep the board firm and rigid? Is it more of an engineering design to layout the board in such a way th
Electronics Forum | Wed May 11 15:30:12 EDT 2005 | amejia
The problem is that we don't use a wave solder machine. Our process right now is that we mask the holes, let it sit at room temperature until it dries, then conformal coat the boards with Humiseal. And, we cannot have the boards ready the day befor
Electronics Forum | Wed Aug 24 12:25:52 EDT 2005 | bman
We've been down this road before, and it doesn't have to be as expensive as it would seem. First, ask your board supplier for a solder sample of the board. They are likely to have a scrap board that you can use for your profiling. As for the BGA(s
Electronics Forum | Thu Aug 25 10:32:03 EDT 2005 | davef
IPC-2221A, Generic Standard on Printed Board Design, the base document that covers all generic requirements for printed board design, regardless of materials. From there, the designer can choose the appropriate sectional standard for a specific techn
Electronics Forum | Wed Sep 21 04:50:10 EDT 2005 | Slaine
i set this up for one of nokias manufacturing plants and based it on the value of the board, caluclated the average rework times, worked out the costs of rework and costs of the board then for each type manufactured put a figure on the number of time
Electronics Forum | Thu Dec 01 21:30:31 EST 2005 | davef
Primary methods used to test assembled circuit boards are: * Automated test equipment [ATE] * Manual bench-top functional test equipment Assembled printed circuit board ATE market segments are: * In-circuit ATE * Functional ATE * Boundary Scan AT
