Electronics Forum | Thu Dec 17 08:31:05 EST 1998 | Dave F
| It looks like a great memory machine, but the thruput is cut in half when running typical SMT boards. | Ya but all gantry machines run at half their highest rated speed in "real life applications." That aside, on paper, this looks like a good mac
Electronics Forum | Fri Sep 10 12:14:00 EDT 1999 | The Guc
| | It looks like a great memory machine, but the thruput is cut in half when running typical SMT boards. | | | Ya but all gantry machines run at half their highest rated speed in "real life applications." That aside, on paper, this looks like a go
Electronics Forum | Tue Dec 15 15:26:23 EST 1998 | Chrys
| Trying to locate a company that I believe was called Addative Technologies, previously located in Tyngsboro, Ma. | | Process is the addition of circuit traces utilizing a conductive ink that is fired and can then be run through the normal processi
Electronics Forum | Thu Dec 24 11:09:26 EST 1998 | Earl Moon
| | Okay here is the deal. I am fairly new to the company here, but one thing I have noticed is that we read way to many fiducials, in my opinon anyway. One for example is this. One assembly was reading 17 fids. Smallest pitch was .25mil I say y
Electronics Forum | Thu Dec 10 13:19:33 EST 1998 | Dave F
| Is there a good way to dispose of above subject? I don't think we can just pitch 'em 'cause they have lead on the pads. There has to be somebody that can grind 'em up or something. Maybe we could even make a little $? Thanks all. | | Ryan | R
Electronics Forum | Thu Dec 10 13:27:36 EST 1998 | Dave F
| Dear everybody : | Does anyone have some information about "bleeder pad"? it seems a method to avoid solder shorts across very small SMT pads.If someone have any idea about it, please contact with me , thanks ! | Young: I'm unfamiliar with the
Electronics Forum | Thu Nov 26 03:59:50 EST 1998 | Chi-Ting Chen
I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cause
Electronics Forum | Thu Nov 26 06:07:40 EST 1998 | Earl Moon
| I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is cau
Electronics Forum | Fri Nov 27 02:09:50 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c
Electronics Forum | Fri Nov 27 02:11:17 EST 1998 | Chi-Ting Chen
| | I have some 1.25 mils Al wire bonding chip on board process. After epxoy-based encapsulation, I do some aging test. How can I "see" or prove that there is a "wire break" exist due to the tension of thermal cycling? How can I know the failure is c