Electronics Forum: board (Page 1221 of 1638)

4C will not home

Electronics Forum | Tue Jan 13 08:08:37 EST 2009 | leemeyer

I am assuming that the card that was changed was the motor driver card. Did they change the card with a known good board or just swap the X and Y cards. If they swapped cards it appears that the card that is now in the X motor slot is bad. Open the a

Epoxy for holding large inductors

Electronics Forum | Wed Jan 14 17:07:46 EST 2009 | davef

In BIG-boy, high vibration applications to secure large components, we've used 3M #2214 structural adhesive [One part, 250*F (121*C) curing 100% solids, paste consistency epoxy adhesives designed for bonding metals and many high temperature plastics

Bubbles in Conformal Coating

Electronics Forum | Fri Jan 16 08:36:40 EST 2009 | davef

That the bubbling gets worse when you run the board through the oven indicates the issue is with the balance between releasing volatiles and cure. Try one of these ideas: * Adjust the atomization pressure, nozzle size, temperature or viscosity of th

Solderability problem II

Electronics Forum | Fri Jan 16 13:11:27 EST 2009 | evtimov

HI , A LOT OF SIMILAR ISSUES WERE DISCUSSED LATELY. MOST OF THE TIME THE PROBLEM IS IN THE BOARD FINISH. THE BEST OPTION IS GOLD FINISH(ENIG). MAKE A SAMPLE AND TRY IT WITH BOTH PASTES YOU HAVE. ANOTHER THING I DID BEFORE AND IT HELPED ME PARTIALLY

What will happen if a sloder paste is used after 24hours

Electronics Forum | Tue Jan 20 08:38:37 EST 2009 | davef

MrDif: You don't add fresh paste to used paste? We add fresh paste to used paste on the stencil to replenish the paste consumed while printing boards, so that we maintain a nice thumb-size roll of paste. We change the used paste when we clean the ste

ENIG

Electronics Forum | Wed Jan 21 04:14:19 EST 2009 | sachu_70

Hi Adam, I would suggest you refer IPC-2221 guidelines which define plating thickness as: Nickel 2.5-5.0 um , Gold 0.08-0.23 um. Although ENIG is a standard process, there is an associated risk towards Gold embrittlement, Porous Gold, or Black pad de

MPA III Power source

Electronics Forum | Wed Jan 21 09:33:41 EST 2009 | pigsinspace

Ok. As you know the machines changed a bit after 95 due to CE regulations. There are no drawing on board/box level in Panasert machines. However normaly i`ts the 100 volts thats "shorting out" the machine and shuts it down. Check all cooling fans a

Problems to use lead free paste in PCB with Pb

Electronics Forum | Tue Feb 03 10:25:56 EST 2009 | milroy

Hi What is the surface finish you have? Following are true if you have HASL-LeadFree surface. I have had the same problem 3years ago and we did some micro-sectioning for further analysis, still the boards are functioning properly. But you have to

Deionized Water Standards

Electronics Forum | Thu Feb 05 18:16:37 EST 2009 | adamcrum

Can somebody help me to understand what standards are in place for deinozed water for cleaning circuit boards. I know they are supposed to be in acordance with J-STD-001D, but what does that entail? All I can find on the internet is that J-STD-001D a

Deionized Water Standards

Electronics Forum | Thu Feb 05 19:40:37 EST 2009 | davef

There is no standard for deionzed water when used to clean boards. As you state, J-STD-001 defines a cleanliness requirement and a method for determining cleanliness. How you go about meeting that requirement is your decision, as it should be. Fresh


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