Electronics Forum | Wed Apr 29 14:03:40 EDT 1998 | Chrys
| We would like to add another pick and place machine to | the SMT line. We're low volume so we change the line over | after each group of boards. So far we've pretty much | ruled out Siplace in favor of the Universal machines. | Does anyone care to
Electronics Forum | Mon Apr 13 16:37:26 EDT 1998 | Steve Gregory
| Wondering if anyone has information on percentage of components that we | can expect to "lose" during our SMT process. We are new to SMT, using | QUAD machines and feel we are losing to many parts during our process. | We are spending a lot of tou
Electronics Forum | Mon Mar 09 10:12:43 EST 1998 | Justin Medernach
| Cold Welding | I'm presently doing a project on reflow profiling. | I came across this expression. Can someone please give me a definition. | Best Regards | Tom Mc Grath Tom, I think what you are referring to is also called cold solder. You have
Electronics Forum | Mon Jan 19 20:01:11 EST 1998 | Steve Gregory
| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Dominic, That is STILL a problem huh? It's a tough one to solve sometimes...especially when you have as
Electronics Forum | Tue Aug 28 13:08:28 EDT 2001 | seand
Hello Everyone, Mountains and mountains of data in the archives. As a contractor the variables in your production lots don't help I'm sure. On a larger scale, one suggestion maybe to first look at when and where your tomb stoning is occuring. 1
Electronics Forum | Fri Jan 11 17:14:13 EST 2002 | davef
We have one product with electroless nickel, immersion silver solderability protection. We do not purport to be experts, but like many things, have seemingly boundless opinions. Side note: There are a least three different [maybe five] imm silver
Electronics Forum | Mon May 20 21:29:52 EDT 2002 | davef
Q1: Are we saying then that IMC can occur at the solder / Cu pad join on the PCB when finished assembled? A1: Yes, but in a broader context I am saying that when someone solders correctly, they form an IMC. Q2: Will the tin diffuse with the Cu over
Electronics Forum | Thu May 09 17:13:10 EDT 2002 | davef
We are converting all our ENIG to imm silver. CHARACTERISTICS * Nominal thickness of the deposit will be 0.1 to 0.3 microns. * Deposit is flat and uniform * It will withstand multiple heat cycles in assembly, which can be problematic with tradition
Electronics Forum | Thu Sep 26 14:03:55 EDT 2002 | Randy V
There are allot of issue to washing that need to be considered before you purchase a washer. But to answer your question regarding ultrasonic cleaning: 1. Ultrasonics with the correct frequency will not damage most components. Washing in general can
Electronics Forum | Tue Dec 03 20:54:57 EST 2002 | davef
Q1:A picture of the sectioned MLCC would be nice. A1: I don't think I can post pics in this (if anyone knows otherwise let me know), so I will email them to anyone who's curious. R1: You�re correct. You cannot post pix on SMTnet. Please email me t
