Electronics Forum | Thu May 28 22:49:32 EDT 1998 | D. Lange
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Thu May 28 08:56:12 EDT 1998 | Earl Moon
| I have a component that is glue cured on the bottom of a pcb. The component is a 1206 size jumper. It is made up of iron/nickel alloy. The problem I am having is that the part will fall off the board during wave solder. Is the component not abl
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
Electronics Forum | Fri May 29 10:21:06 EDT 1998 | Dave
| I'm in the process of doing an evaluation fora big board machine. My choices are Universal HSP 4791 and Fuji CP6-5. | Has anyone one a subjective evaluation on both machines? If so what was the outcome, abd experiences since installing the selected
Electronics Forum | Tue May 12 12:28:22 EDT 1998 | Rin Or
| I'm in the process of doing an evaluation fora big board machine. My choices are Universal HSP 4791 and Fuji CP6-5. | Has anyone one a subjective evaluation on both machines? If so what was the outcome, abd experiences since installing the selected
Electronics Forum | Tue May 12 12:27:52 EDT 1998 | Rin Or
| I'm in the process of doing an evaluation fora big board machine. My choices are Universal HSP 4791 and Fuji CP6-5. | Has anyone one a subjective evaluation on both machines? If so what was the outcome, abd experiences since installing the selected
Electronics Forum | Tue May 12 04:15:48 EDT 1998 | Chris Sargent
Help! We have been doing some trials on Paste Through Hole and have encountered a problem. The screen is designed (as is suggested in technical info re PTH) to give double the paste volume required to fill the void between the pin and via. The pro
Electronics Forum | Tue May 12 10:50:58 EDT 1998 | Chrys
| We are having continuous bridging problems with the trailing | leads on a 26-pin D-sub through-hole connector. The pitch is | 0.100". The connector is going through the wave at approximately | a 20 Degree angle. Does anyone have any board layout r
Electronics Forum | Mon May 11 13:59:53 EDT 1998 | Chris Fontaine
| Hello. | 1 Could anyone tell me the range of temperature | to solder MI components? The process eng is using 400~500 | degrees Celcius!! For standard 0805/0603 chips & TH components & | also to touch up on ICs. What is the con
Electronics Forum | Wed May 13 16:39:41 EDT 1998 | Herb Pabes
| | Hello. | | 1 Could anyone tell me the range of temperature | | to solder MI components? The process eng is using 400~500 | | degrees Celcius!! For standard 0805/0603 chips & TH components & | | also to touch up on ICs. What
