Electronics Forum | Mon Sep 20 20:43:19 EDT 2021 | ttheis
One of our GSM machines started having an issue with "spitting" parts onto the board / blowing them around. I determined the problem be that spindle #2 on our flex head is not touching the parts all the way down to the board. It is stopping just abov
Electronics Forum | Wed Jun 01 12:06:49 EDT 2022 | proceng1
I am not quite clear what you are asking, but I'll give it a shot. Once the P&P program is put into the machine, the operator will load a bare board and step through the program using the machine camera to verify that part outlines match up to the bo
Electronics Forum | Wed Oct 26 22:39:01 EDT 2022 | sarason
This is not really a bug. The logic is this if you place a component beyond the edge of the board, it should falloff! So instead on having a very complex algorithm to work out component centres and then make a judgement as to whether the connector is
Electronics Forum | Thu Nov 03 07:46:07 EDT 2022 | umar
Hi Team Members, I am a PCBA manufacturing assy process, we have a V groove and Hole type panel boards that running at my production side, Any one can advice whether the router machine is suitable for those V groove panel PCBA ? or router only ap
Electronics Forum | Wed Nov 16 21:35:07 EST 2022 | stephendo
" so I wander what can I do to save them?" The boards or management? Seriously I think this is more of a management issue than a technical issue. We can suggest what to do but if management does not accept that solution then it won't work. I'm not s
Electronics Forum | Fri Oct 13 10:44:03 EDT 2023 | yannick_herzog
Hello, thank you for your responses. Some time has passed since then. Unfortunately, we have been facing the issue of incomplete filling in the production when it comes to large openings in the template. This phenomenon occurs in both directions. T
Electronics Forum | Wed Jan 03 17:37:16 EST 2024 | davef
IPC Releases IPC-6012F, Qualification and Performance Specification for Rigid Printed Boards Changes address advances in rigid printed board fabrication processes Oct 18, 2023 [https://www.ipc.org/news-release/ipc-releases-ipc-6012f-qualification-and
Electronics Forum | Mon May 24 04:01:10 EDT 1999 | Joe Manzur
John, We are using a well known solder paste, begining with the letter "H". (I don't want to be accused of advertising). Also, we are now using a board inverter. In the early day's however, before we purchased a board inverter, we were having to
Electronics Forum | Thu Feb 19 11:47:06 EST 2015 | dad23honu
I had someone in another forum tell me that my assembly would fail if I had a few solder joints over the 1000ppm RoHS threshold, with all other solder joints within spec. So, I followed up with this illustration. Please let me know what you think.
Electronics Forum | Wed Mar 01 17:13:15 EST 2000 | Dave F
Sorin: Formulas for calculating heat dissipation of traces don�t seem to provide practical results. But there are some wonderful tables and graphs that will meet you needs. You may need to do some finagling when calculating vias and through holes,
