Electronics Forum | Thu Apr 01 09:10:55 EST 2004 | cyclopsn
We are currently using non clean paste and non clean flux in our manufacturing process. But recently our customer feedback that using a non clean process might cause flux blockage in via hole area and potentially might burn or explode the boards over
Electronics Forum | Wed Apr 14 12:23:59 EDT 2004 | Ted
Hi everyone! I am looking for a lead-free solder that will survive a customer reflow of 260C. I am currently using SN10/Pb88/Ag02 but the reflow temperature is to high (320C) for the FR4 boards that we have. I know there are higher temp FR4 boards
Electronics Forum | Wed Apr 28 10:29:04 EDT 2004 | dougt
By "placement pressure" I assume you mean force. I don't know of placement machines that have transducers mounted on the placement spindles that actually measure force. We made a board with a force sensor mounted through a hole so that it was the sa
Electronics Forum | Fri Apr 30 15:11:53 EDT 2004 | pjc
MPM has a new board support system called GelFlex. It can be used on UltraPrint 2000 machines as well as AP series, UP1500 and AccuFlex models. For more info, go to http://www.speedlinetech.com/mpm/gel-flex.aspx also, contact Chris Wild at Speedline
Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2
Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo
Electronics Forum | Fri May 21 20:48:09 EDT 2004 | My Nguyen
I read the messsages but I did not meet my need. We currently have Excellon and ATI machines. They work ok for thick boards (40 mils and above) but for thin, small boards (15-20 mils and USB side dimension), it did not fulfill our needs. So, pleas
Electronics Forum | Wed Jun 02 15:29:47 EDT 2004 | pr
Make sure the board is stopping at the center of the worknest or you will waste lots of time (you'll get software limit errors when you try to find fids.). If it's not in the center, you need to go in and reteach from scratch (doesn't take too long).
Electronics Forum | Thu Jun 17 10:57:41 EDT 2004 | RicardoF
Believe me, I don't see any problem about optimization on Placement equipment nor printing or even the oven, my concerns are with the people: - Am I on the limit to assemble about 1100 to 1200 boards per shift (8 hours)? I have seen some of our lines
Electronics Forum | Sat Jun 12 00:34:00 EDT 2004 | kanwal324
Hi ! The main problem being faced currently is formation of solder balls - to be precise, these are micro solder beads generally found attached with bodies of SOTs, Chip Caps, Chip Resistors, between pins of SOICs (50 mil) - lying on PCB surface,
Electronics Forum | Mon Jun 14 14:39:12 EDT 2004 | davef
HASL Thickness: * HADCO DFM manual specifies a nominal thickness of 50-1500uin with an option for 100-1000uin * Merix DFM manual specifies 30-200uin IPC-6012, Class 1, 2, 3 do not spec a HASL thickness at all but only require that full coverage is m
