Electronics Forum | Tue Sep 26 11:03:00 EDT 2000 | Wolfgang Busko
Greg: You might look for : - smallest board size - largest board size - finest pitch you are able to handle (safe) - Parts/hour - units/hour (If you find your bottleneck it will be easy to determine) - number and kind of feeders, components per line
Electronics Forum | Fri Sep 22 07:35:37 EDT 2000 | Henrik Eklund
Hello everyone out there, I have been working in the SMT process for a couple o years now, and now I'm partly responsible for the turret head component mounting process. We are about to buy new equipment and I want to do a capability study of this m
Electronics Forum | Wed Sep 20 19:43:06 EDT 2000 | Dave F
Some RF components are made in copper in weird spiral and parallel strip-line shapes. I'd either: * Send the boards back to where ever you got them and tell that bird brain to use SM-782 pads and practices. ... OR * Get the bird brain that sent you
Electronics Forum | Sat Sep 09 08:21:36 EDT 2000 | Sal
guys Currently experienced this problem on a product which had been running satifactorily for a period of time. No process changes were made, The problem was highlighted when after ICT when the boards were loaded in to the stress chamber, after the
Electronics Forum | Tue Aug 29 17:05:00 EDT 2000 | Travis Slaughter
There are a large number of variables that determine how many tabs are needed. The biggest ones I can think of, off the top of my head are. Board thickness .031 needs more than .093 Process and equipment used in assembly some processes and equipment
Electronics Forum | Thu Aug 24 05:44:10 EDT 2000 | Wolfgang Busko
Me too. It was the first time that I heard about that "preheated pallet thing" and wonder to what temperature and with what kind of equipment it is heated up. Do different handling and transporttime have any effect on the resulting board temperatur
Electronics Forum | Tue Aug 22 12:14:21 EDT 2000 | Tekguy2000
There are concretions that form inside the chamber when using a water soluble paste. They start forming and affecting print as early as 2 days. This is apparent no matter what type of print head you may be using. There has been over 30 water soluble
Electronics Forum | Tue Aug 15 16:57:54 EDT 2000 | Doug Philbrick
In many threads here I have read and talked about Electroless Gold problems and have experienced my own problems with it. Love to hear what others are doing as a replacement. Is it Electroless tin, is it osp or is HASL good enough for .031 pitch BGA
Electronics Forum | Thu Aug 10 13:36:48 EDT 2000 | Bob Willis
I recently have been examining multilayer board failures. They are the classic inner connection failure between the foil and the through hole plating which I have not seen in many years. Has any one experienced any issues recently specifically relati
Electronics Forum | Fri Aug 04 11:04:27 EDT 2000 | John
We manufacture a mixed technology board, that uses a through hole "mini cap" with a 2.5 mm lead span. We have had several failures caused by solder wicking up through the plated through hole pcb and touching the can. This shorts out the capacitor.
