Electronics Forum | Fri Jun 22 13:13:54 EDT 2001 | dougt
I worked as a tech for a company that produced momagraphy equipment about 5 years ago. Every so often we had a problem with a board that was suspected to be the board material itself and used the mamography equipment to check this. In some cases it
Electronics Forum | Wed Jul 11 14:08:21 EDT 2001 | markhoch
Are you guys providing adequate board support during glue dispense and placement? I've had this same problem with 0603's that I was able to correct with adequate board support. Also, if you're using a Fuji glue machine, what are your temperature sett
Electronics Forum | Tue Jul 10 08:45:12 EDT 2001 | stefwitt
There are several low cost vision systems ( under $ 5,000) on the market: http://www.dvtsensors.com" ,Keyence, Texas Instruments, Imagenation. If they can capture the image in one shot ( comparing with one good board ) depends on the camera resolutio
Electronics Forum | Thu Jul 12 20:55:37 EDT 2001 | davef
First, we don�t like pallets, but ya gotta do wat ya gotta do!!! Second, we used to pallet after print and before place, but we lost so many prints messing with palleting boards that we now pallet, print, place. Third, most of our pallets are �home
Electronics Forum | Sun Jul 29 09:17:20 EDT 2001 | davef
Tough to say, but ... Chlorine: Many fluxes contain chlorine. Sulphur: Many solders and paper packing materials contain sulphur. Sodium: No idea. IPC-J-001 talks to board cleanliness and specifies criteria according to the cleanliness test met
Electronics Forum | Sun Feb 06 07:49:16 EST 2000 | Dave F
Casimir: A comment and a couple questions: * Have you considered a machine that forms component leads to "self-clinch?" With this forming components snap into hole in the boards with the proper finished lead length and requires not trimming after
Electronics Forum | Tue Feb 01 04:11:58 EST 2000 | emmanuel
I am to assembly a power SO on the top side of a double side board. My designer has implemented a lot of thermal vias in the heat sink pad of this component. The problem is that i need to prevent the solder cream from polluting the bottom side of the
Electronics Forum | Wed Feb 02 03:32:08 EST 2000 | pascal MATHIEU
emmanuel : i agree with Dave , it's easy to have blind hole on the bottom side , of course in this case you'll lose some thermal efficiency ;the second solution is to put on the bottom side between the board and your heatsink a soft thermal interfac
Electronics Forum | Wed Jan 26 21:23:51 EST 2000 | Dennis
Hello! all Will anybody give me advice for missing componets for 0402, 0603 R or C chips? I am not gonna tell you which machine I use, but from my experience, every p&p machine has possibility for missing component after placing 400 or more componen
Electronics Forum | Wed Jan 12 18:00:12 EST 2000 | David J Nowak
We have a quad flatpack that is adhesively bonded to the face of the printed wiring board. We need to remove it from the board. The leads have been unsoldiered. We are thinking of placing a rectangular cavity on the end of a shaft over the QFP and
