Electronics Forum | Wed May 28 12:31:18 EDT 2003 | larryk
This is our first experience with running embedded flexs. Our board supplier suggested that we prebake our assemblies before placing components. What does everyone else do? Is prebaking normal when a flex is embedded?
Electronics Forum | Tue Jun 03 16:45:30 EDT 2003 | swagner
I agree with the other posting about V-score but don't forget about a Wand punch if the application is high volume, also IPTE manufactures a cutting system that doesn't require any V-score, it just cuts the boards apart with a diamond wheel.
Electronics Forum | Wed Jun 04 20:09:01 EDT 2003 | stefwitt
The tact time is determined by the slowest machine in the line. In your case it is 4.5 min. This is the time from the board leaving the output conveyor sensor to the next board leaving the sensor. The first machine, which finishes the job in 3 min. h
Electronics Forum | Tue Jun 10 16:51:19 EDT 2003 | davef
Develop your recipe wave soldering exactly as you developed your recipe for reflow soldering. The only difference is that instead of using your paste supplier's recommendations as the starting point, use your flux supplier's recommendations as a bas
Electronics Forum | Wed Jun 11 09:16:05 EDT 2003 | davef
Il ne pas de quois. Two most important parameters are: * Solder temperature * Dwell time Immersion depth [1/3 to 2/3 of board thickness] has the least impact of any variable in wave soldering.
Electronics Forum | Wed May 12 09:59:42 EDT 2004 | gregoryyork
May'be after all these years your eye sight could be failing,other postings including mine asked board type and machine type and set up etc etc. Oh well
Electronics Forum | Tue Jun 10 16:11:19 EDT 2003 | Fred Matthews
Entering the world of Electrolysis Imersion Silver as a board finish. Have two customers...one using Alpha and the other using Sterling as the silver used in the process. What are the differences? What are the process hits (if any) for the two? Any
Electronics Forum | Thu Jun 19 08:00:41 EDT 2003 | shaun
what type of oven do you have . How many zones? and what are the board attributes sizes. We run alot of doublesided reflow with BGA. maybe I can help
Electronics Forum | Tue Jun 17 20:03:44 EDT 2003 | samaniegocesar
Hello Jipp. Before I recomend something, can you send to me a picture of the PCB (Bare board) and one picture with the PCB with components, I could help you. samaniegocesar@smtnet.com, samaniegocesar@hotmail.com Regards...
Electronics Forum | Wed Jun 25 18:35:28 EDT 2003 | Brian W.
Most of the time, Ceramic cracks are cracked due to mechanical stress. Check your depaneling methods. Cermaic caps that are close and perpendicular to the board edge are especially susceptible.
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