Electronics Forum | Wed Jun 11 12:29:19 EDT 2003 | JB
There are many variables that could cause components to be misplaced. Using the overall tack time reduction is in reality putting a band-aid on a larger problem. Are your small components shifted as well? ( 0402,0805 tec) Components "twisted or off
Electronics Forum | Wed Jun 25 18:17:48 EDT 2003 | Brian W.
Water soluble pastes generally work best with a ramp-to-spike reflow profile. Check your paste manufacturer's recommended profile. There are many factors that impact your profile; board thickness, component density, buried thermal masses, board si
Electronics Forum | Thu Jun 19 10:36:54 EDT 2003 | Jacob
Hi all I am having a reflow problem. Recently we started using a through hole connector with solder flux bearing technology on a densly populated board. The connector reflows at the same time as the smt components through reflow. The problem I am ha
Electronics Forum | Mon Jul 07 11:45:45 EDT 2003 | lromero
Do you know what the maximum temperature rating is for the devices. But in my past experience you could be seeing the following. Excess thermal ramp rates typically you would like to see 2 to 3C/sec in the reflow oven, if it is greater than this i wo
Electronics Forum | Thu Jul 03 12:03:00 EDT 2003 | slthomas
So, there is a crack or gap between: * Solder and component termination. Bingo Correct? Describe: * Coarseness / smoothness of the metal on the termination underneither the crack. * Solder left on the termination. Unfortunately at 45X I can't rea
Electronics Forum | Fri Jul 04 09:10:53 EDT 2003 | davef
With poorly cured mask: * Wave soldering: Expect to see thin wavy band of dross imbedded in the mask in the wave solder side. * Reflow soldering: Expect to see a pinto board where the two tones of mask are [1] normal color and [2] a lighter color, al
Electronics Forum | Tue Jul 08 20:24:26 EDT 2003 | davef
AlCapone: Consider determining the responsible party according to their ability to deal with the complexity of collecting and analyzing the information required to determine your process capability index. For expample: * Reflow oven: Fairly simple,
Electronics Forum | Mon Jul 28 08:54:52 EDT 2003 | davef
You are 100% correctomundo about ENIG. When it's good it's good, BUT when it's bad, you just want something else. You know you have black pad, when you see parts falling from the board. First, there is not perfect solderability protection. Second
Electronics Forum | Mon Aug 18 12:02:18 EDT 2003 | russ
It all dependes on the de-paneling method. V-score - .100" is probably to thick for manual seperation. There are machines that I believe can cut through a V-Score up to .125" or greater Breakaway tabs - .100" is getting to the limit when doing t
Electronics Forum | Wed Sep 17 04:15:23 EDT 2003 | C Miller
The magnetic thing from the sot23 thread made me think of somthing from the past. Does anyone have any experience with vibrating boards during reflow? I know for a fact that if you vibrate a board during reflow it will alow the parts to "float" and
