Electronics Forum | Thu Mar 16 07:02:38 EST 2000 | Scott Davies
Does anybody have any experience or knowledge of processing PCB assemblies featuring pyroelectric sensor devices, the type used in Passive Infra-Red Sensor modules? Since these devices are, by definition, very sensitive to heat, how do you get round
Electronics Forum | Tue Feb 29 21:18:00 EST 2000 | Gwen Z
When an assemblied board was on active service, what's the main reason for its failure:the package broken; the mechanics fatigue failure under thermal cycle; the corrosion caused by salt and vapor; the broken chip inside the package etc. I think all
Electronics Forum | Thu Mar 02 15:20:13 EST 2000 | Glenn Robertson
Dave - You certainly have a good point regarding the multiple part numbers and board suppliers, but a rework process for black pad has been reported. See the SMTAI 1999 Proceedings article by Zequn Mei (page 407). It involves flux and solder wi
Electronics Forum | Mon Feb 28 08:18:03 EST 2000 | Engineer
I'm currently researching new rework equipment, and was wondering if anyone had any recommendations. We currently have an older PACE hot air system that has had mixed results. It tends to overheat the board and IC. Is the IR any better, or has hot ai
Electronics Forum | Tue Feb 22 19:21:05 EST 2000 | Peter
I like MPM's 500 machine. I purchased the predecessor model when it was made by SMTech. This machine has programmable pin supports which made setting up for double sided boards really easy. For auto alignment, I think only in-line machines have th
Electronics Forum | Wed Feb 16 23:17:13 EST 2000 | Richard Moreno
Does anyone know of a SMT reflow modeling simulation that I could use as a baseline for reflow profiling? I'm looking for a quick means of setting up oven profiles for various oven sizes based upon board density (grams/sq in) and conveyor speed.
Electronics Forum | Wed Feb 16 20:51:37 EST 2000 | Jim
We have to place some LCC208's. The terminations are flush with the underside of the package, on an 0.5mm pitch. The pads on the board are flat tin. We'd like to get the part up in the air a little to provide some clearance for cleaning. Is there a w
Electronics Forum | Thu Feb 01 20:21:34 EST 2001 | huat
Hi, Currently, we use kapton tape to tape out the goldfinger at our area. We still experience solder at goldfinger area, suspected is from washing of misprint boards. Can someone advice me on what is the method being use to clean the goldfi
Electronics Forum | Wed Feb 07 12:56:00 EST 2001 | jax
I' ll have to agree with Dave on this one. Just get the information from the Suppliers. The Glass plate, Aluminum board, Glass slugs, etc... are all used to determine if a calibration is needed or if it was succesful.( they can also give you offset i
Electronics Forum | Mon Feb 19 13:49:44 EST 2001 | markkrmp
Bill, It is my understanding that in using the Smart Sonic to clean Adhesives from stencils and mis-printed boards it is recommended to have the system up to a certain heated temperature. What is that recommended temperature? Does this temperature
