Electronics Forum | Wed Jun 27 15:21:28 EDT 2001 | H.Richter
Hello; Can anyone give me advise on the best way to manually align a 20"x20" stencil on a semi-automatic printer? We have a board with a 16 mil pitch QFP and have difficulty aligning the stencil. We have tried various alignment schemes on the pcb an
Electronics Forum | Fri Jul 20 10:35:34 EDT 2001 | slthomas
David, I've thought about doing this also with no clean boards that were poorly cleaned following a misprint (and subsequently reprinted, populated, and reflowed) but have shyed away because of the potential for damage to components from the ultraso
Electronics Forum | Fri Jul 06 09:39:18 EDT 2001 | johnw
Hi guys I am having problems with skewed placement of 0402 devices I would like to add the board has raised pads and we are placing on glue. We are now printing the glue rather that dispensing with a GL5. have any of you guys had this pro
Electronics Forum | Tue Jul 10 05:23:21 EDT 2001 | dhanashekar
DEAR ALL WE ARE LOOKING FOR A DIGITAL VIDEO COMPARATOR ,AN INSPECTION TOOL WHICH WILL HELP ME TO LOOK FOR ,MISSING COMPONENTS,VALUE,DIRCTION ETC, AND IT SHOULD BE ABLE TO BE PROGRAMMED BY PLACING A GOOD BOARD. IT SHOULD ACT MORE LIKE AN AUTOMATIC OP
Electronics Forum | Thu Jul 12 20:48:12 EDT 2001 | davef
Hey, ya got me using IE, didn�t ya? Ya just gotta diversify cuz ya never know when a board stuffin� gig will end, do ya? And I do have a hat with a gear on it. So, all I�d have to do is change it out for a propeller!!!
Electronics Forum | Wed Jul 18 18:07:11 EDT 2001 | trgedlin
We're looking at buying some new hand insertion slide lines here, and I was curious if anyone had any suggestions. Of course cost and footprint size are important. What we have now are mostly home made and we're looking to improve. We do a medium
Electronics Forum | Tue Jul 24 09:15:47 EDT 2001 | gdstanton
Folks, Does anyone have data to support that a minimum clearance left around the perimeter of a BGA on a board design can improve its solderability? In other words, if X distance is left open (free of components) around the BGA, could ball solderab
Electronics Forum | Tue Jul 24 14:00:08 EDT 2001 | Steve Schrader
Greg, Yes, I did my tour of duty. Is your boss back from Bermuda yet? If so, tell her to check her email! Thanks. BTW, there could be a benefit to moving parts, but that would be dictated by your ability/inability to achieve a proper reflow prof
Electronics Forum | Tue Jul 24 20:00:40 EDT 2001 | davef
There is too little heat to make the solder flow properly. Test this theory by profiling on the pad where the solder doesn�t flow well. As the time after posting this thread increases, we generally propose additional theories. Rather than us specu
Electronics Forum | Mon Jul 30 21:03:44 EDT 2001 | davef
You should specify the level of res based on the effect of the res on the end-use of the product. J-STD-001 defines cleanliness requirements for ALL flux types, including water soluble and no-clean that you mention. 1 There is no equivalency betwee
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