Electronics Forum | Fri Dec 13 09:06:30 EST 2002 | russ
One thing I have found when using square or diamond etc... Fiducials is, if it is a HASL finish board, the finish may be thick and the fid camera will see them having rounded edges different sizes etc.. and will cause quality failures. Russ (My sp
Electronics Forum | Tue Dec 17 08:46:59 EST 2002 | Randy Villeneuve
Personaly I would try a different solder paste. Give Indium a call and get a sample of their SMQ92J No clean. You will be impressed. Alpha and Kester also have good products but we have a long history with this paste and we have printed millions of b
Electronics Forum | Mon Dec 16 15:00:56 EST 2002 | sueph
We have always baked our assembled boards prior to wave solder, but have recently learned that there are some companies out there who don't. I checked with one of my supervisors, and he said that baking is recommended but not required. I'm wonderin
Electronics Forum | Wed Dec 25 19:36:57 EST 2002 | MA/NY DDave
Hi DaveF already gave you some fine answers. Yes I have seen CNC routed copper PWBs, and the literature is filled with many unique trace types including laying of fine wires on a board or embedded. You wanting .15mm, and I am guessing, low resistan
Electronics Forum | Mon Dec 30 01:31:36 EST 2002 | MA/NY DDave
Hi I think you already have the answer. It isn't the same as the true comparator of yesteryear, yet YES, some of the assembly machines have visualization post placement, compared to a golden board or dimensional images imported into the software.
Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef
Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta
Electronics Forum | Thu Jan 09 18:19:51 EST 2003 | babe
The Ersa system is fine however there are thermocoupling problems and the service from Ersa has been very poor of late. The Metcal won't handle larger boards and the heating is inconsistent.Especially with BGA components. We see this via inspection
Electronics Forum | Sun Jan 19 10:25:54 EST 2003 | davef
You shouldn't freak. You want the pads on both sides of the BGA ball the same so that the torgue from changes in dimension due to different CTE [ie, interposer, solder, bare board, etc.] is balanced on the top and the bottom of the ball. So, the ma
Electronics Forum | Wed Jan 22 09:59:28 EST 2003 | Juan C. Ruiz
I would like to know how to decide what to use: a batch oven or a conventional reflow oven to cure an underfill material that require 20 min@150 C. the size of the board is 50 X 100 mm. Cycle time previous to cure is 2 minutes. The lenght of the refl
Electronics Forum | Wed Jan 22 19:37:48 EST 2003 | bradlanger
My company is getting into smt and am looking for advice on placement equipment. Our largest board is 7" x 13". The smallest parts are 0805, we only have soic so far and our volume is low to mid scale. Who makes a accurate, reliable, versitile, small
