Electronics Forum | Thu Oct 15 13:55:43 EDT 1998 | Steve A
Dave, The first step would be to learn to accept the residue. IPC class 2 has no problem with it. If that is not possible, I am not sure why a no clean is necessary- but I will take your work for it. Alcohols will dry out the residue, and turn it
Electronics Forum | Thu Oct 15 16:39:07 EDT 1998 | Dave F
Steve: I thought Kyzen products were "additives" to either aqueous or semiaqueous inline or batch machine cleaning processes. I'm trying to clean the no-clean residue from a few components that can not bear to see water. Can you use Kyzen products
Electronics Forum | Tue Oct 13 12:58:18 EDT 1998 | Justin Medernach
| We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will impact
Electronics Forum | Tue Oct 13 16:26:26 EDT 1998 | Earl Moon
| | We suffered our first blood letting because of razor sharp edge clamps (DEK 265LT) and operator giving it the finger. While positioning magnetic tooling pins, one of our best slipped and really sliced off a part of his main digit. This will impac
Electronics Forum | Wed Oct 07 14:55:17 EDT 1998 | Joe P.
| | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remain
Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger
| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema
Electronics Forum | Thu Oct 08 22:32:58 EDT 1998 | Dave F
| | | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the re
Electronics Forum | Thu Oct 08 12:11:34 EDT 1998 | Rick Wyman
| Does anyone know of an AOI system that can look at the solder joints of SMT chip devices (1206,0805 & 0603) and make a reliable presence/abscence call of the joint on a HASL PCB. A low false call rate (much less than 1%)is required. Any info. fro
Electronics Forum | Thu Oct 01 19:07:48 EDT 1998 | Paul R. Smith
Kyung Sam, Justin is correct, there is definately either a board design problem or the PCB maker issue. Obviously there are many mixed technology boards built in the world so I would lean towards a design issue as the root cause. Should you or you
Electronics Forum | Fri Aug 21 14:29:37 EDT 1998 | Earl Moon
| HASL: (hot air solder leveling) is a process used to cover the Cu. Either Sn/Pb is used or Ni/Au or some other combo. In one case you create a land pad and in the other (with resin)you cover the Cu so that you only have a "trace." Is that correct s
.gif)
