Electronics Forum | Wed Oct 06 04:23:09 EDT 1999 | Brian
| | I am a new employee at a company that has had a large turnover of employees over the past year. I am working on a board (components on one side only), the engineer (he is also new ) wants to use an .035 pad with a .021 dia. hole, there are no via
Electronics Forum | Tue Oct 05 01:22:46 EDT 1999 | Karlin
| I am working on trying to define a cost per placement measure in our SMT assembly operations. | | Does anyone know where I might find a published industry average that we may compare to? | | I�ve heard it stated that an industry average is less t
Electronics Forum | Mon Oct 04 07:47:34 EDT 1999 | park kyung sam
| | What are pro's and con's of reflowing top side first and curing bottom side chip components, and then wave soldering bottom side? | | | | How about curing bottom side first and reflowing top side later? | | | | What percentage of companies run
Electronics Forum | Mon Sep 20 12:19:13 EDT 1999 | Brian
| Hi all, | | We have a little discussion here about the suitable flux for a certain process, as all of us are beginners we need your advice. | | We are producing VGA cards and mother boards for PC's all components to be wave soldered are TH, the S
Electronics Forum | Fri Sep 10 09:03:52 EDT 1999 | ScottM
| | hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the prec
Electronics Forum | Thu Sep 09 10:09:15 EDT 1999 | John Thorup
| | | I have a board that has surface mount on both sides . On this board is a 22pin connector which is the only thru-hole part.This part is located on the component side. I would like to reflow this part. Can this be done? If so, how can this be don
Electronics Forum | Thu Aug 19 13:43:59 EDT 1999 | Earl Moon
| | OK folks, let's get real serious. | | | | Well, I shot off my big mouth yesterday during a scheduling meeting concerning DFM and rework. Again, what an irony, oxymoron, or that other thing. | | | | Anyway, I said it would take another 4 weeks t
Electronics Forum | Tue Aug 03 17:28:33 EDT 1999 | DLKearns
| | | I have been asked to supply a maximum shelf life for our assemblied PCB's. I realise this is dependent on so many factors- temperature, humidity, no of layers etc. But does anyone have a formulae for calculating shelf life, or does anyone know
Electronics Forum | Tue Jul 27 11:32:01 EDT 1999 | M.L.
| | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | 12BGA per assembly | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | Pads .014inch | | Vias within footprint .020inch | | Vias to be filled by bottom side(solder side) only
Electronics Forum | Sat Jul 24 10:20:15 EDT 1999 | Bob Willis
PCB Solder Finishes Survey Questions 1999 Results for the 1996-7 survey are located at www.smartgroup.org As a number of SMART people have requested an update on the solder finishes survey SMART Group have run in the past here is your opportunity t
