Electronics Forum | Mon Jun 11 22:01:30 EDT 2001 | davef
Others make good points. Consider "TP-1115 - Selection & Implementation Strategy for A Low-Residue No-Clean Process" as a starting point. Remember that in-bound components and boards can be loaded with unNC res that can turn the best implemented
Electronics Forum | Tue Jun 12 20:36:00 EDT 2001 | ianchan
Hi mates, thanks for the interest on this topic, just to share info to clarify any queries : 1) am using light blue-grey materials for the Pallet 2) am using Hot Air Convection Reflow Oven 3) I suspect its due to the Pallet materials properties, t
Electronics Forum | Mon Jun 11 14:25:36 EDT 2001 | CPI
I had the very same problem but, did not question my oven as I knew the profile was good and I should have had even heating. So I then looked at pad size and layout. When Layout and size were found to be ok. I attached a prob to each pad and ran a pr
Electronics Forum | Thu Jun 14 21:14:04 EDT 2001 | davef
There�s tons of stuff on-line. Do a net search on "immersion silver". Examples are: * http://www.smta.org/knowledge/proceedings_abstract.cfm?PROCEEDING_ID=571 * http://www.enthone-omi.com/articles/FinalFinishesT1.pdf * http://www.epa.gov/opptintr
Electronics Forum | Fri Jun 22 11:54:47 EDT 2001 | jdtpfacreate
OEM Boy, This is an excellent question. Since I am on the "I-want-to-sell-you-equipment-side" I do not have the hands-on experience that you do but, I do have a many engineers back at our factory who have dedicated their lives to these issues.
Electronics Forum | Thu Jun 21 12:05:54 EDT 2001 | brownsj
I used to assembly 0402 devices on to a double sided PCBA using a 96% tin 4% silver alloy. This material printed fine but the higher processing temperatures did present a problem. This material had a melting point of 221 deg C which required a peak r
Electronics Forum | Fri Jun 22 05:03:29 EDT 2001 | wbu
no - can it be left uncleaned on the board? ---> for many applications yes says our supplier and many companies do ( techi over there) - are our products specified for conditions that we and our customers can live with that? ---> well, at first
Electronics Forum | Thu Jun 28 22:42:13 EDT 2001 | davef
I�m with Stefan � no booze, drugs, or chewing tobacco in the shop!!! [I�d like to ban facial make-up, but am still limping from the last time I tried.] Stefan, how are you going to get the P&P manufacturers to agree on a common nozzle design, when
Electronics Forum | Mon Jun 25 06:07:56 EDT 2001 | mzaboogie
Hello, I have a board that has been giving us problems for some time now. It is fairly well populated, mostly with IC's and SOT's on the topside. There is a Zilinx QFP160. This component does not reflow well. All of the other components look OK. A t
Electronics Forum | Wed Jul 11 13:41:37 EDT 2001 | procon
Hi Chris, Dave F is absolutely correct in his assunption that the leads are hotter than the pads. You must profile from the pads to see the exact temperature that they are reaching. If the entire board reflows properly as you described, don't get ca
