Electronics Forum | Fri Jul 31 09:12:35 EDT 2009 | gregoryyork
Dear Sean Contrary to believe MOST formulators of No Clean fluxes or No Residue fluxes use organic acides that are in fact weak and benign. IF the residue was left on the board and you had a condensing atmosphere then you may see some issue with fal
Electronics Forum | Tue Aug 04 17:37:43 EDT 2009 | gregoryyork
Im not sure that 0.004% is that critical in a solder alloy. If people are using our alloy and the Nickel increases we would most probably suggest running a dopant alloy without Nickel to bring the levels back down, it is very rare to require dumping
Electronics Forum | Fri Aug 14 10:51:30 EDT 2009 | rway
If he is the same Martin Gershenson who works for Christopher, then I'de believe he's being sneaky. We demoed one of their units three years ago, along with Mirtech and YesTech. Of the three, they were the only ones who wouldn't let us experiment w
Electronics Forum | Tue Aug 18 10:17:15 EDT 2009 | grantp
Hi, You don't need X-ray and all that crap. I would get an old MYDATA TP9 or something like that, and a manual stencil printer and a batch oven or a small inline oven. Should do the trick and be very low cost. Should be simple to use as well. Tha
Electronics Forum | Fri Aug 21 13:45:12 EDT 2009 | rossi
We are using a vapor phase oven which we have used successfully for a number of years with both leaded and unleaded solders. Recently we experienced problems with a no lead BGA that has low silver balls. The problem is that the soldered boards do no
Electronics Forum | Thu Aug 27 10:22:59 EDT 2009 | dwl
We have an opportunity to purchase a Yestech YTV-1000 AOI machine. I am looking for opinions on how well they work and how they compare to the newer Yestech B3 AOI systems. We are a high mix, low volume EMS company. We do not currently have any exp
Electronics Forum | Thu Sep 03 12:03:52 EDT 2009 | Sean
Hi All, I have few questions about creeping corrosion that potentially happen on lead free immersion silver PCB as below: 1) What test that we can conducted to verify whether the failure we seen is due to creeping corrosion? 2) I heard that lead fr
Electronics Forum | Fri Oct 09 13:37:55 EDT 2009 | tstrat
We are seeing similar issues. We have a board that consistently has failures on a BGA part. After SEM/EDS it was shown that the fractures were occurring between the Ni-P and Ni-Sn intermetallic in the ENIG finish. The element map showed elevated conc
Electronics Forum | Thu Oct 01 07:03:55 EDT 2009 | davef
We doubt that Humiseal 1A33 is causing opens in your assemblies. We'd guess the opens occur earlier in the process, but are not hard failures. So, you pass your tests. When applied, the conformal coat flows into the gap in the ball crack and insulate
Electronics Forum | Thu Oct 08 01:07:46 EDT 2009 | tpappano
I have used 1A33 for many years with excellent results on through-hole pcbs in equipment subjected to very hot and very cold environments. Because 1A33 continues to harden with time, I assumed it would simply not be usable on smt boards, cracking t